HP Compaq 6710b User Manual

Grounding guidelines
Electrostatic discharge damage
Electronic components are sensitive to electrostatic discharge (ESD). Circuitry design and structure
determine the degree of sensitivity. Networks built into many integrated circuits provide some protection,
but in many cases, ESD contains enough power to alter device parameters or melt silicon junctions.
A discharge of static electricity from a finger or other conductor can destroy static-sensitive devices or
microcircuitry. Even if the spark is neither felt nor heard, damage may have occurred.
An electronic device exposed to ESD may not be affected at all and can work perfectly throughout a
normal cycle. Or the device may function normally for a while, then degrade in the internal layers,
reducing its life expectancy.
CAUTION: To prevent damage to the computer when you are removing or installing internal
components, observe these precautions:
Keep components in their electrostatic-safe containers until you area ready to install them.
Use nonmagnetic tools.
Before touching an electronic component, discharge static electricity by using the guidelines described in
this section.
Avoid touching pins, leads, and circuitry. Handle electronic components as little as possible.
If you remove a component, place it in an electrostatic-safe container.
The following table shows how humidity affects the electrostatic voltage levels generated by different
activities.
CAUTION: A product can be degraded by as little as 700 V.
Typical electrostatic voltage levels
Relative humidity
Event 10% 40% 55%
Walking across carpet 35,000 V 15,000 V 7,500 V
Walking across vinyl floor 12,000 V 5,000 V 3,000 V
Motions of bench worker 6,000 v 800 V 400 V
Removing DIPS from plastic tube 2,000 V 700 V 400 V
Removing DIPS from vinyl tray 11,500 V 4,000 V 2,000 V
Removing DIPS from Styrofoam 14,500 V 5,000 V 3,500 V
Removing bubble pack from PCB 26,500 V 20,000 V 7,000 V
Packing PCBs in foam-lined box 21,000 V 11,000 V 5,000 V
ENWW Preliminary replacement requirements 43

HP Compaq 6710b Specifications

General

Operating temperature (T-T)	0 - 35 °C
Operating relative humidity (H-H)	10 - 90 %
Discrete graphics card	Yes
Discrete graphics card model	Intel® GMA X3100
Maximum graphics card memory	0.384 GB
Bus type	FSB
Stepping	M0
Tjunction	105 °C
Processor cache	3 MB
Processor cores	2
Processor model	T8300
System bus rate	- GT/s
Processor family	Intel® Core™2 Duo
Processor series	Intel Core 2 Duo T8000 Series
Processor socket	Socket 479
Processor codename	Penryn
Processing Die size	107 mm²
Processor frequency	2.4 GHz
Processor cache type	L2
Processor lithography	45 nm
Processor system type	Up
Processor manufacturer	Intel
Processor front side bus	800 MHz
Processor operating modes	64-bit
ECC supported by processor	No
Thermal Design Power (TDP)	35 W
CPU multiplier (bus/core ratio)	12
Number of Processing Die Transistors	410 M
HDD speed	5400 RPM
HDD interface	SATA
Optical drive type	DVD Super Multi DL
Card reader integrated	-
Total storage capacity	160 GB
Number of HDDs installed	1
Operating system installed	Windows Vista Business
Operating system architecture	32-bit
Display diagonal	15.4 \
Display resolution	- pixels
Memory slots	2x SO-DIMM
Memory upgrade	4 GB
Internal memory	2 GB
Memory clock speed	667 MHz
Internal memory type	DDR2-SDRAM
Type	PC
Modem speed	56 Kbit/s
Power supply type	AC/DC
Wireless technology	Wi-Fi
Compatible operating systems	Windows Vista
Motherboard chipset	Intel® GM965
Audio system	HD
Pointing device	Touchpad + Scroll zone
Bluetooth version	2.0+EDR
TV-out type	S-Video
Charging port type	DC-in jack
HDMI ports quantity	0
USB 2.0 ports quantity	4
Cable lock slot type	Kensington
Battery capacity	55 Wh
Battery life (max)	5.1 h
Number of battery cells	6
AC adapter power	90 W
Product color	Black
Country of origin	China
Processor code	SLAPR
Processor ARK ID	33099
Processor package size	35 x 35 mm

Weight and Dimensions

Depth	265 mm
Width	357 mm
Weight	2600 g
Height (front)	34 mm