NOTE: To properly ventilate the computer, allow at least a 7.6-cm (3-inch) clearance on the left and
right sides of the computer.
The computer uses an electric fan for ventilation. The fan is controlled by a temperature sensor and is
designed to turn on automatically when high temperature conditions exist. These conditions are affected
by high external temperatures, system power consumption, power management/battery conservation
configurations, battery fast charging, and software applications. Exhaust air is displaced through the
ventilation grill located on the left side of the computer.
Heat sink
NOTE: All heat sink spare part kits include thermal material.
Description Spare part number
For use with HP Compaq 6715 computer models 443912-001
For use with HP Compaq 6710 computer models 446920-001
Thermal Material Kit for use in all countries and regions except Japan and Asia/Pacific 413706-001
Thermal Material Kit for use in Japan and Asia/Pacific countries and regions 445853-001
Before removing the heat sink, follow these steps:
1.
Shut down the computer. If you are unsure whether the computer is off or in Hibernation, turn the
computer on, and then shut it down through the operating system.
2.
Disconnect all external devices connected to the computer.
3.
Disconnect the power from the computer by first unplugging the power cord from the AC outlet and
then unplugging the AC adapter from the computer.
4.
Remove the battery (see
Battery on page 48).
5.
Release the keyboard (see
Keyboard on page 64).
6.
Remove the switch cover (see
Switch cover on page 70).
7.
Remove the internal memory module (see
Internal memory module on page 66). This step applies
only to HP Compaq 6710 computer models.
8.
Remove the fan (see
Fan on page 71).
Remove the heat sink:
NOTE: Step 1 applies to HP Compaq 6715 computer models. The heat sink on HP Compaq 6710
computer models is secured to the computer by captive screws which must be loosened rather than
removed.
1. Remove the four Phillips PM2.0×6.0 screws (1) that secure the heat sink to the system board.
2. Release the heat sink (2) by lifting the right side until it disengages from the processor.
NOTE: Due to the adhesive quality of the thermal material located between the heat sink and
processor, it may be necessary to move the heat sink from side to side to detach the heat sink from
the processor.
72 Chapter 4 Removal and replacement procedures ENWW
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General
Weight and Dimensions
