HP ENVY 13 User Manual

7 Drives and external devices
Drives
Identifying installed drives
Your computer includes a hard drive (with a rotating disc) or a solid-state drive (SSD) with solid-state
memory. Because it has no moving parts, an SSD does not generate as much heat as a hard drive.
To view the drives installed on the computer, select Start > Computer.
NOTE: Windows® includes the User Account Control feature to improve the security of your computer.
You may be prompted for your permission or password for tasks such as installing applications, running
utilities, or changing Windows settings. Refer to Help and Support for more information.
Handling drives
Drives are fragile computer components that must be handled with care. Refer to the following cautions
before handling drives. Additional cautions are included with the procedures to which they apply.
CAUTION: To reduce the risk of damage to the computer, damage to a drive, or loss of information,
observe these precautions:
Before you move a computer that is connected to an external hard drive, initiate Sleep and allow the
screen to clear, or properly disconnect the external hard drive.
Handle a drive carefully; do not drop a drive or place items on it.
When the battery is the only source of power, be sure that the battery is sufficiently charged before
writing to media.
Avoid exposing a drive to temperature or humidity extremes.
Avoid exposing a drive to liquids. Do not spray the drive with cleaning products.
Avoid exposing a drive to magnetic fields. Security devices with magnetic fields include airport walk-
through devices and security wands. The airport security devices that check carry-on luggage, such as
conveyor belts, use X-rays instead of magnetism and will not damage a drive.
Improving hard drive performance
Using Disk Defragmenter
As you use the computer, files on the hard drive become fragmented. Disk Defragmenter consolidates
the fragmented files and folders on the hard drive so that the system can run more efficiently.
Drives 55

HP ENVY 13 Specifications

General

Form factor	Clamshell
Product type	Laptop
Product color	Silver
Country of origin	China
Internal memory	8 GB
Memory clock speed	1600 MHz
Memory form factor	On-board
Internal memory type	LPDDR3-SDRAM
Memory layout (slots x size)	1 x 8 GB
LED backlight	Yes
Display diagonal	13.3 \
Display resolution	3200 x 1800 pixels
Native aspect ratio	16:9
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
Storage media	SSD
Total storage capacity	512 GB
Compatible memory cards	SD
Number of SSDs installed	1
Speakers manufacturer	Bang & Olufsen
Number of built-in speakers	2
Wi-Fi standards	802.11b, 802.11g, Wi-Fi 4 (802.11n), 802.11a, Wi-Fi 5 (802.11ac)
Bluetooth version	4.0
Charging port type	DC-in jack
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	3
USB 3.2 Gen 1 (3.1 Gen 1) Type-C ports quantity	0
Battery capacity	45 Wh
On-board graphics card ID	1916
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 520
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	1.74 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	300 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1050 MHz
Sustainability certificates	EPEAT Silver, ENERGY STAR
Pointing device	Touchpad
Cable lock slot type	Kensington
AC adapter power	45 W
Operating system architecture	64-bit
Bus type	OPI
Stepping	D1
Tjunction	100 °C
Processor cache	4 MB
System bus rate	4 GT/s
Processor family	Intel® Core™ i7
Processor series	Intel Core i7-6500 Mobile series
Processor socket	LGA 1356 (Socket B2)
Processor threads	4
Processor codename	Skylake
Configurable TDP-up	25 W
Processor frequency	2.5 GHz
Processor cache type	Smart Cache
Configurable TDP-down	7.5 W
Processor lithography	14 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	3.0
Processor boost frequency	3.1 GHz
PCI Express configurations	1x4, 4x1
Thermal Design Power (TDP)	15 W
Configurable TDP-up frequency	2.6 GHz
Configurable TDP-down frequency	0.8 GHz
Maximum number of PCI Express lanes	12
Processor code	SR2EZ
Processor ARK ID	88194
Processor package size	42 X 24 mm
Supported instruction sets	SSE4.1, SSE4.2, AVX 2.0
Intel Secure Key Technology version	1.00
Intel Stable Image Platform Program (SIPP) version	0.00

Weight and Dimensions

Depth	226 mm
Width	326.5 mm
Height	12.9 mm
Weight	1390 g