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HP ENVY 13 User Manual

HP ENVY 13
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Note the following guidelines before creating recovery discs:
You will need high-quality DVD-R, DVD+R, BD-R (writable Blu-ray), or CD-R discs. All these discs
are purchased separately. DVDs and BDs have a much higher capacity than CDs. If you use CDs,
up to 20 discs may be required, whereas only a few DVDs or BDs are required.
NOTE: Read-write discs, such as CD-RW, DVD±RW, double-layer DVD±RW, and BD-RE
(rewritable Blu-ray) discs, are not compatible with the Recovery Manager software.
The computer must be connected to AC power during this process.
Only one set of recovery discs can be created per computer.
Number each disc before inserting it into the optical drive.
If necessary, you can exit the program before you have finished creating the recovery discs. The
next time you open Recovery Manager, you will be prompted to continue the disc creation process.
To create a set of recovery discs:
1. Select Start > All Programs > Recovery Manager > Recovery Disc Creation.
2. Follow the on-screen instructions.
Backing up your information
As you add new software and data files, you should back up your system on a regular basis to maintain
a reasonably current backup. Back up your system at the following times:
At regularly scheduled times
NOTE: Set reminders to back up your information periodically.
Before the computer is repaired or restored
Before you add or modify hardware or software
Note the following when backing up:
Create system restore points using the Windows® System Restore feature, and periodically copy
them to disc.
Store personal files in the Documents library and back up this folder periodically.
Back up templates stored in their associated programs.
Save customized settings in a window, toolbar, or menu bar by taking a screen shot of your settings.
The screen shot can be a time-saver if you have to reset your preferences.
To copy the screen and paste it into a word-processing document, follow these steps:
1. Display the screen.
2. Copy the screen:
To copy only the active window, press alt+prt sc.
To copy the entire screen, press prt sc.
Backing up your information 77

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HP ENVY 13 Specifications

General IconGeneral
Form factorClamshell
Product typeLaptop
Product colorSilver
Country of originChina
Internal memory8 GB
Memory clock speed1600 MHz
Memory form factorOn-board
Internal memory typeLPDDR3-SDRAM
Memory layout (slots x size)1 x 8 GB
LED backlightYes
Display diagonal13.3 \
Display resolution3200 x 1800 pixels
Native aspect ratio16:9
SSD capacityThe Solid State Drive's storage capacity in Gigabytes.
Storage mediaSSD
Total storage capacity512 GB
Compatible memory cardsSD
Number of SSDs installed1
Speakers manufacturerBang & Olufsen
Number of built-in speakers2
Wi-Fi standards802.11b, 802.11g, Wi-Fi 4 (802.11n), 802.11a, Wi-Fi 5 (802.11ac)
Bluetooth version4.0
Charging port typeDC-in jack
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity3
USB 3.2 Gen 1 (3.1 Gen 1) Type-C ports quantity0
Battery capacity45 Wh
On-board graphics card ID1916
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics 520
On-board graphics card familyIntel® HD Graphics
Maximum on-board graphics card memory1.74 GB
On-board graphics card OpenGL version4.4
On-board graphics card base frequency300 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)1050 MHz
Sustainability certificatesEPEAT Silver, ENERGY STAR
Pointing deviceTouchpad
Cable lock slot typeKensington
AC adapter power45 W
Operating system architecture64-bit
Bus typeOPI
SteppingD1
Tjunction100 °C
Processor cache4 MB
System bus rate4 GT/s
Processor familyIntel® Core™ i7
Processor seriesIntel Core i7-6500 Mobile series
Processor socketLGA 1356 (Socket B2)
Processor threads4
Processor codenameSkylake
Configurable TDP-up25 W
Processor frequency2.5 GHz
Processor cache typeSmart Cache
Configurable TDP-down7.5 W
Processor lithography14 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version3.0
Processor boost frequency3.1 GHz
PCI Express configurations1x4, 4x1
Thermal Design Power (TDP)15 W
Configurable TDP-up frequency2.6 GHz
Configurable TDP-down frequency0.8 GHz
Maximum number of PCI Express lanes12
Processor codeSR2EZ
Processor ARK ID88194
Processor package size42 X 24 mm
Supported instruction setsSSE4.1, SSE4.2, AVX 2.0
Intel Secure Key Technology version1.00
Intel Stable Image Platform Program (SIPP) version0.00
Weight and Dimensions IconWeight and Dimensions
Depth226 mm
Width326.5 mm
Height12.9 mm
Weight1390 g

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