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HP Pavilion dm4 User Manual

HP Pavilion dm4
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Packaging and transporting guidelines
Follow these grounding guidelines when packaging and transporting equipment:
To avoid hand contact, transport products in static-safe tubes, bags, or boxes.
Protect ESD-sensitive parts and assemblies with conductive or approved containers or
packaging.
Keep ESD-sensitive parts in their containers until the parts arrive at static-free workstations.
Place items on a grounded surface before removing items from their containers.
Always be properly grounded when touching a component or assembly.
Store reusable ESD-sensitive parts from assemblies in protective packaging or nonconductive
foam.
Use transporters and conveyors made of antistatic belts and roller bushings. Be sure that
mechanized equipment used for moving materials is wired to ground and that proper materials
are selected to avoid static charging. When grounding is not possible, use an ionizer to dissipate
electric charges.
Workstation guidelines
Follow these grounding workstation guidelines:
Cover the workstation with approved static-shielding material.
Use a wrist strap connected to a properly grounded work surface and use properly grounded
tools and equipment.
Use conductive field service tools, such as cutters, screwdrivers, and vacuums.
When fixtures must directly contact dissipative surfaces, use fixtures made only of static-safe
materials.
Keep the work area free of nonconductive materials, such as ordinary plastic assembly aids and
Styrofoam.
Handle ESD-sensitive components, parts, and assemblies by the case or PCM laminate. Handle
these items only at static-free workstations.
Avoid contact with pins, leads, or circuitry.
Turn off power and input signals before inserting or removing connectors or test equipment.
38 Chapter 4 Removal and replacement procedures

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HP Pavilion dm4 Specifications

General IconGeneral
Bus typeDMI
SteppingC2
Tjunction105 °C
Processor cache3 MB
Processor cores2
System bus rate2.5 GT/s
Processor familyIntel® Core™ i5
Processor seriesIntel Core i5-400 Series
Processor socketBGA 1288
Processor threads4
Processor codenameArrandale
Processing Die size81 mm²
Processor frequency2.26 GHz
Processor cache typeSmart Cache
Processor lithography32 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version2.0
Processor boost frequency2.53 GHz
Processor operating modes64-bit
ECC supported by processorNo
PCI Express configurations1x16
Thermal Design Power (TDP)35 W
CPU multiplier (bus/core ratio)17
Maximum number of PCI Express lanes16
Number of Processing Die Transistors382 M
Motherboard chipsetIntel® HM55 Express
Memory slots2x SO-DIMM
Internal memory3 GB
Memory clock speed1333 MHz
Internal memory typeDDR3-SDRAM
Maximum internal memory8 GB
Memory layout (slots x size)1 x 1 + 1 x 2 GB
HDD interfaceSATA
Storage mediaHDD
Optical drive typeDVD Super Multi
Card reader integratedYes
Total storage capacity500 GB
Compatible memory cardsMemory Stick (MS), MMC, MS PRO, SD, xD
Number of HDDs installed1
Display diagonal14 \
Display brightness200 cd/m²
Display resolution1366 x 768 pixels
Native aspect ratio16:9
Contrast ratio (typical)500:1
Display response rise/fall8 ms
TypePC
LightScribe-
Disc types supportedCD-R, CD-ROM, CD-RW, DVD+R, DVD+RW, DVD-R, DVD-RAM, DVD-ROM, DVD-RW
Ethernet interface typeGigabit Ethernet
On-board graphics card modelIntel® HD Graphics
On-board graphics card base frequency500 MHz
On-board graphics card dynamic frequency (max)766 MHz
Speakers manufacturerAltec Lansing
Video capturing speed24 fps
Front camera resolution640 x 480 pixels
Wi-Fi standards802.11b, 802.11g, Wi-Fi 4 (802.11n)
Cabling technology10/100/1000Base-T(X)
Networking featuresGigabit Ethernet, WLAN
Ethernet LAN data rates10, 100, 1000 Mbit/s
Charging port typeDC-in jack
Headphone connectivity3.5 mm
USB 2.0 ports quantity3
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity0
Pointing deviceTouchpad
Operating system installedWindows 7 Home Premium
Form factorClamshell
Product typeLaptop
Country of originChina
Battery life (max)- h
Number of battery cells6
AC adapter power65 W
Cable lock slot typeKensington
Processor codeSLBPM
Processor ARK ID43537
Processor package sizerPGA 37.5x 37.5, BGA 34x28 mm
Graphics & IMC lithography45 nm
Supported instruction setsSSE4.1, SSE4.2
Intel® Turbo Boost Technology1.0
Operating altitude-15 - 3048 m
Non-operating altitude-15 - 12192 m
Storage temperature (T-T)-20 - 60 °C
Operating temperature (T-T)5 - 35 °C
Storage relative humidity (H-H)5 - 95 %
Operating relative humidity (H-H)10 - 90 %
Weight and Dimensions IconWeight and Dimensions
Depth228 mm
Width340.8 mm
Weight1990 g
Height (rear)32.2 mm
Height (front)25 mm
Depth (imperial)8.98 \
Width (imperial)13.7 \
Height (rear) (imperial)1.26 \
Height (front) (imperial)0.98 \

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