HP Pavilion dm4 User Manual

System board
NOTE: All system board kits include replacement thermal material.
Description Spare part number
System board for use in models with 1 GB of HD5450 discrete graphics memory 616244-001
System board for use in models with 512 MB of HD5450 discrete graphics memory 608203-001
System board for use in HM55 models with 512 MB of HD5470 discrete graphics memory 621044-001
System board for use in HM55 models with 1 GB of HD5470 discrete graphics memory 621045-001
System board for use in HM55 models with 512 MB of HD6370 discrete graphics memory 630713-001
System board for use in HM55 models with 1 GB of HD6370 discrete graphics memory 630714-001
System board for use in models with UMA graphics 608204-001
System board for use in HM55 models with WiMAX and UMA graphics 633863-001
When replacing the system board, be sure that the following components are removed from the
defective system board and installed on the replacement system board:
●
SIM (see
SIM on page 43)
●
RTC battery (see
RTC battery on page 46)
●
Memory modules (see
Memory module on page 44)
●
WLAN module (see
WLAN module on page 47)
●
WWAN module (see
WWAN module on page 51)
●
Fan/heat sink assembly (see
Fan/heat sink assembly on page 80)
●
Processor (see
Processor on page 85)
Before removing the system board, follow these steps:
1. Shut down the computer. If you are unsure whether the computer is off or in Hibernation, turn
the computer on, and then shut it down through the operating system.
2. Disconnect all external devices connected to the computer.
3. Disconnect the power from the computer by first unplugging the power cord from the AC outlet
and then unplugging the AC adapter from the computer.
4. Remove the battery (see
Battery on page 42).
5. Remove the following components:
a. Hard drive (see
Hard drive on page 53)
b. WLAN module (see
WLAN module on page 47)
c. WWAN module (see
WWAN module on page 51)
d. Optical drive (see
Optical drive on page 55)
78 Chapter 4 Removal and replacement procedures

HP Pavilion dm4 Specifications

General

Bus type	DMI
Stepping	C2
Tjunction	105 °C
Processor cache	3 MB
Processor cores	2
System bus rate	2.5 GT/s
Processor family	Intel® Core™ i5
Processor series	Intel Core i5-400 Series
Processor socket	BGA 1288
Processor threads	4
Processor codename	Arrandale
Processing Die size	81 mm²
Processor frequency	2.26 GHz
Processor cache type	Smart Cache
Processor lithography	32 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor boost frequency	2.53 GHz
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x16
Thermal Design Power (TDP)	35 W
CPU multiplier (bus/core ratio)	17
Maximum number of PCI Express lanes	16
Number of Processing Die Transistors	382 M
Motherboard chipset	Intel® HM55 Express
Memory slots	2x SO-DIMM
Internal memory	3 GB
Memory clock speed	1333 MHz
Internal memory type	DDR3-SDRAM
Maximum internal memory	8 GB
Memory layout (slots x size)	1 x 1 + 1 x 2 GB
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi
Card reader integrated	Yes
Total storage capacity	500 GB
Compatible memory cards	Memory Stick (MS), MMC, MS PRO, SD, xD
Number of HDDs installed	1
Display diagonal	14 \
Display brightness	200 cd/m²
Display resolution	1366 x 768 pixels
Native aspect ratio	16:9
Contrast ratio (typical)	500:1
Display response rise/fall	8 ms
Type	PC
LightScribe	-
Disc types supported	CD-R, CD-ROM, CD-RW, DVD+R, DVD+RW, DVD-R, DVD-RAM, DVD-ROM, DVD-RW
Ethernet interface type	Gigabit Ethernet
On-board graphics card model	Intel® HD Graphics
On-board graphics card base frequency	500 MHz
On-board graphics card dynamic frequency (max)	766 MHz
Speakers manufacturer	Altec Lansing
Video capturing speed	24 fps
Front camera resolution	640 x 480 pixels
Wi-Fi standards	802.11b, 802.11g, Wi-Fi 4 (802.11n)
Cabling technology	10/100/1000Base-T(X)
Networking features	Gigabit Ethernet, WLAN
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Charging port type	DC-in jack
Headphone connectivity	3.5 mm
USB 2.0 ports quantity	3
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	0
Pointing device	Touchpad
Operating system installed	Windows 7 Home Premium
Form factor	Clamshell
Product type	Laptop
Country of origin	China
Battery life (max)	- h
Number of battery cells	6
AC adapter power	65 W
Cable lock slot type	Kensington
Processor code	SLBPM
Processor ARK ID	43537
Processor package size	rPGA 37.5x 37.5, BGA 34x28 mm
Graphics & IMC lithography	45 nm
Supported instruction sets	SSE4.1, SSE4.2
Intel® Turbo Boost Technology	1.0
Operating altitude	-15 - 3048 m
Non-operating altitude	-15 - 12192 m
Storage temperature (T-T)	-20 - 60 °C
Operating temperature (T-T)	5 - 35 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	10 - 90 %

Weight and Dimensions

Depth	228 mm
Width	340.8 mm
Weight	1990 g
Height (rear)	32.2 mm
Height (front)	25 mm
Depth (imperial)	8.98 \
Width (imperial)	13.7 \
Height (rear) (imperial)	1.26 \
Height (front) (imperial)	0.98 \