EasyManuals Logo
Home>HP>Laptop>TOUCHSMART TM2

HP TOUCHSMART TM2 Maintenance And Service Guide

HP TOUCHSMART TM2
109 pages
To Next Page IconTo Next Page
To Next Page IconTo Next Page
To Previous Page IconTo Previous Page
To Previous Page IconTo Previous Page
Page #13 background imageLoading...
Page #13 background image
Item Component Function
(6) Convertible hinge Swivels the display and converts the computer from
traditional notebook mode to slate mode or from slate
mode to notebook mode. In slate mode, the display is
rotated and folded flat, so that you can view content
while carrying the computer.
*The antennas are not visible from the outside of the computer. For optimal transmission, keep the areas immediately around
the antennas free from obstructions. To see wireless regulatory notices, refer to the section of the Regulatory, Safety and
Environmental Notices that applies to your country or region. These notices are located in Help and Support.
Keys
Item Component Function
(1) esc key Displays system information when pressed in
combination with the fn key.
(2) fn key Executes frequently used system functions when pressed
in combination with an arrow key or the esc key.
(3) Windows logo key Displays the Windows Start menu.
(4) Windows applications key Displays a shortcut menu for items beneath the cursor.
(5) Action keys Execute frequently used system functions.
ENWW
Top components
5

Table of Contents

Other manuals for HP TOUCHSMART TM2

Questions and Answers:

Question and Answer IconNeed help?

Do you have a question about the HP TOUCHSMART TM2 and is the answer not in the manual?

HP TOUCHSMART TM2 Specifications

General IconGeneral
Bus typeDMI
SteppingK0
Tjunction105 °C
Processor cache3 MB
Processor cores2
System bus rate2.5 GT/s
Processor familyIntel® Core™ i3
Processor seriesIntel Core i3-300 Mobile Series
Processor socketBGA 1288
Processor threads4
Processor codenameArrandale
Processing Die size81 mm²
Processor frequency1.33 GHz
Processor cache typeSmart Cache
Processor lithography32 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version2.0
Processor boost frequencyThe turbo boost is an automatic, managed accelleration of the processor when one of the cores is overloaded.
Processor operating modes64-bit
ECC supported by processorNo
PCI Express configurations1x16
Thermal Design Power (TDP)18 W
CPU multiplier (bus/core ratio)10
Maximum number of PCI Express lanes16
Number of Processing Die Transistors382 M
Motherboard chipsetIntel® HM55 Express
Internal memory3 GB
Internal memory typeDDR3-SDRAM
Maximum internal memory8 GB
Memory layout (slots x size)1 x 1 + 1 x 2 GB
HDD speed7200 RPM
HDD interfaceSATA
Storage mediaHDD
Optical drive typeDVD Super Multi DL
Card reader integratedYes
Total storage capacity320 GB
Compatible memory cardsMemory Stick (MS), MMC, MS PRO, SD, xD
Number of HDDs installed1
Display diagonal12.1 \
Touch technologyMulti-touch
Display resolution1280 x 800 pixels
Native aspect ratio16:10
Ethernet interface typeGigabit Ethernet
Operating temperature (T-T)41 - 95 °F
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics
On-board graphics card base frequency166 MHz
On-board graphics card dynamic frequency (max)500 MHz
Audio systemDolby Advanced
Speakers manufacturerAltec Lansing
Wi-Fi standards802.11b, 802.11g, Wi-Fi 4 (802.11n)
Cabling technology10/100/1000Base-T(X)
Networking featuresGigabit LAN, WLAN
Ethernet LAN data rates10, 100, 1000 Mbit/s
Charging port typeDC-in jack
USB 2.0 ports quantity3
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity0
Keyboard layout-
Pointing deviceClickpad
Operating system installedWindows 7 Home Premium
Form factorConvertible (Swivel)
Product typeHybrid (2-in-1)
Country of originChina
Battery life (max)- h
Number of battery cells6
AC adapter power65 W
Cable lock slot typeKensington
Operating altitude-15 - 3048 m
Non-operating altitude-15 - 12192 m
Storage temperature (T-T)-20 - 60 °C
Storage relative humidity (H-H)5 - 95 %
Operating relative humidity (H-H)10 - 90 %
Processor codeSLBSL
Processor ARK ID50028
Processor package sizeBGA 34 x 28 mm
Graphics & IMC lithography45 nm
Supported instruction setsSSE4.1, SSE4.2
Weight and Dimensions IconWeight and Dimensions
Depth326 mm
Width230 mm
Weight1893 g
Height (rear)30 mm
Height (front)24.3 mm

Related product manuals