HP TOUCHSMART TM2 Maintenance And Service Guide

Updating the BIOS
Updated versions of the BIOS may be available on the HP Web site.
Most BIOS updates on the HP Web site are packaged in compressed files called SoftPaqs.
Some download packages contain a file named Readme.txt, which contains information regarding
installing and troubleshooting the file.
Determining the BIOS
To determine whether available BIOS updates contain later BIOS versions than those currently installed
on the computer, you need to know the version of the system BIOS currently installed.
BIOS version information (also known as ROM date and System BIOS) can be displayed by pressing fn
+esc (if you are already in Windows) or by opening Setup Utility.
To use Setup Utility for displaying BIOS information:
1. Open Setup Utility by turning on or restarting the computer. While the “Press the ESC key for
Startup Menu” message is displayed in the lower-left corner of the screen, press f10.
2. If Setup Utility does not open with the system information displayed, use the arrow keys to select
the Main menu.
When the Main menu is selected, BIOS and other system information is displayed.
3. To exit Setup Utility, use the arrow keys to select Exit > Exit Discarding Changes, and then
press enter.
Downloading a BIOS update
CAUTION: To prevent damage to the computer or an unsuccessful installation, download and install
a BIOS update only when the computer is connected to reliable external power using the AC adapter.
Do not download or install a BIOS update while the computer is running on battery power, docked in
an optional docking device, or connected to an optional power source. During the download and
installation, follow these instructions:
Do not disconnect power from the computer by unplugging the power cord from the AC outlet.
Do not shut down the computer or initiate Sleep or Hibernation.
Do not insert, remove, connect, or disconnect any device, cable, or cord.
ENWW
Updating the BIOS
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HP TOUCHSMART TM2 Specifications

General

Bus type	DMI
Stepping	K0
Tjunction	105 °C
Processor cache	3 MB
Processor cores	2
System bus rate	2.5 GT/s
Processor family	Intel® Core™ i3
Processor series	Intel Core i3-300 Mobile Series
Processor socket	BGA 1288
Processor threads	4
Processor codename	Arrandale
Processing Die size	81 mm²
Processor frequency	1.33 GHz
Processor cache type	Smart Cache
Processor lithography	32 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor boost frequency	The turbo boost is an automatic, managed accelleration of the processor when one of the cores is overloaded.
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x16
Thermal Design Power (TDP)	18 W
CPU multiplier (bus/core ratio)	10
Maximum number of PCI Express lanes	16
Number of Processing Die Transistors	382 M
Motherboard chipset	Intel® HM55 Express
Internal memory	3 GB
Internal memory type	DDR3-SDRAM
Maximum internal memory	8 GB
Memory layout (slots x size)	1 x 1 + 1 x 2 GB
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi DL
Card reader integrated	Yes
Total storage capacity	320 GB
Compatible memory cards	Memory Stick (MS), MMC, MS PRO, SD, xD
Number of HDDs installed	1
Display diagonal	12.1 \
Touch technology	Multi-touch
Display resolution	1280 x 800 pixels
Native aspect ratio	16:10
Ethernet interface type	Gigabit Ethernet
Operating temperature (T-T)	41 - 95 °F
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics
On-board graphics card base frequency	166 MHz
On-board graphics card dynamic frequency (max)	500 MHz
Audio system	Dolby Advanced
Speakers manufacturer	Altec Lansing
Wi-Fi standards	802.11b, 802.11g, Wi-Fi 4 (802.11n)
Cabling technology	10/100/1000Base-T(X)
Networking features	Gigabit LAN, WLAN
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Charging port type	DC-in jack
USB 2.0 ports quantity	3
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	0
Keyboard layout	-
Pointing device	Clickpad
Operating system installed	Windows 7 Home Premium
Form factor	Convertible (Swivel)
Product type	Hybrid (2-in-1)
Country of origin	China
Battery life (max)	- h
Number of battery cells	6
AC adapter power	65 W
Cable lock slot type	Kensington
Operating altitude	-15 - 3048 m
Non-operating altitude	-15 - 12192 m
Storage temperature (T-T)	-20 - 60 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	10 - 90 %
Processor code	SLBSL
Processor ARK ID	50028
Processor package size	BGA 34 x 28 mm
Graphics & IMC lithography	45 nm
Supported instruction sets	SSE4.1, SSE4.2

Weight and Dimensions

Depth	326 mm
Width	230 mm
Weight	1893 g
Height (rear)	30 mm
Height (front)	24.3 mm