LTE Module Series
EM05 Hardware Design
EM05_Hardware_Design Confidential / Released 52 / 59
6.8. ESD Characteristics
The following table shows the ESD characteristics of EM05.
Table 32: ESD Characteristics of EM05
For a good ESD performance, the module mounting holes must be used to attach the device to the main
PCB ground closely.
6.9. Thermal Consideration
EM05 is designed to work over an extended temperature range. In order to achieve a maximum
performance while working under extended temperatures or extreme conditions (such as with maximum
power or data rate, etc.) for a long time, it is strongly recommended to add a heat sink (a thermal
compound or pad must be used between the module and the metal heat sink) between the module and
the main PCB for thermal dissipation.
Please add ground vias as many as possible on PCB for better heat dissipation. It is NOT recommended
to apply solder mask on the main PCB below the thermal dissipation area of EM05, and the module
should be kept away from heating sources.
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