HCD-FX200/FX205
2
TABLE OF CONTENTS
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
This appliance is classifi ed as
a CLASS 1 LASER product.
This marking is located on the
rear exterior.
1. SERVICING NOTES ............................................. 3
2. DISASSEMBLY
2-1. Disassembly Flow .......................................................... 5
2-2. Panel (Rear) Block ......................................................... 5
2-3. Top Panel Block ............................................................. 6
2-4. Front Panel Block ........................................................... 6
2-5. Knob (VOL) .................................................................... 7
2-6. MAIN Board ................................................................... 7
2-7. Base Unit (BU-D1BD73U) ............................................ 8
2-8. Optical Pick-up Block (DA11MMVGP) ........................ 8
3. TEST MODE ............................................................ 9
4. ELECTRICAL CHECK ......................................... 10
5. DIAGRAMS
5-1. Block Diagram - CD, TUNER, USB Section - ............... 11
5-2. Block Diagram
- OUTPUT, PANEL, POWER SUPPLY Section - ......... 12
5-3. Printed Wiring Board - BD73U Board - ........................ 14
5-4. Schematic Diagram - BD73U Board - ........................... 15
5-5. Printed Wiring Board - USB Board - .............................. 16
5-6. Schematic Diagram - USB Board - ................................. 17
5-7. Schematic Diagram - MAIN Section (1/2) - ................... 18
5-8. Schematic Diagram - MAIN Section (2/2) - ................... 19
5-9. Printed Wiring Boards - MAIN Section - ....................... 20
5-10. Printed Wiring Board - PANEL Board - ......................... 21
5-11. Schematic Diagram - PANEL Board (1/2) - ................... 22
5-12. Schematic Diagram - PANEL Board (2/2) - ................... 23
5-13. Printed Wiring Board
- PT Board (Except E2, E51 and EA models) - ............. 24
5-14. Schematic Diagram
- PT Board (Except E2, E51 and EA models) - ............. 24
5-15. Printed Wiring Board
- PT-SW Board (E2, E51 and EA models) - .................. 25
5-16. Schematic Diagram
- PT-SW Board (E2, E51 and EA models) - .................. 25
6. EXPLODED VIEWS
6-1. Overall Section .............................................................. 32
6-2. Top Panel Section ........................................................... 33
6-3. Front Panel Section ........................................................ 34
6-4. Chassis Section ............................................................... 35
7. ELECTRICAL PARTS LIST .............................. 36
Accessories are given in the last of the electrical parts list.
Ver. 1.1
• Abbreviation
E2 : 120V AC area in E model
E51 : Chilean and Peruvian models
EA : Saudi Arabia model
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