Maintenance
Table 6-2: Inte
rnal inspection checklist
Item Inspect for Repair action
Circuit boards
Loose, broken
, or corroded solder
connections. Burned circuit boards.
Burned, broken, or cracked circuit-run
plating.
Remove and rep
lace damaged circuit board.
Resistors Burned, cracked, broken, blistered
condition.
Remove and replace damaged circuit board.
Solder conn
ections
Cold solder
or rosin joints.
Resolder joint and clean with isopropyl
alcohol.
Capacitor
s
Damaged or
leaking cases. Corroded
solder on leads or terminals.
Remove and replace damaged circuit board.
Wiring and
cables
Loose plug
s or connectors. Burned, broken,
or frayed wiring.
Firmly sea
t connectors. Repair or replace
modules with defective wires or cables.
Chassis Dents, deformations, and damaged
hardware.
Straighten, repair, or replace defective
hardware.
Cleaning Procedure,
Interior
To clean the oscilloscope interior, perform the following steps:
1. Blow off dust with dry, low-pressure, deionized air (approximately 9 psi).
2. Remove any remaining dust with a lint-free c loth dampened in isopropyl
alcohol (75% solution) and then wipe with a lint-free cloth dampened with
warm deionized water. A cotton-tipped applicator is useful for cleaning in
narrow spaces and on circuit boards.
STOP. If, after performing steps 1 and 2, a module is clean on inspection, skip
steps 3, 4, and 5. Proceed with step 6.
6–4 TDS2000C Series Oscilloscope Service Manual
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