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1-4-2 DVDP_SN

3. The flat pack-IC on the BOARD is affixed with

glue, so be careful not to break or damage the foil

of each pin or the solder lands under the IC when

removing it.

With Soldering Iron:

1. Using desoldering braid, remove the solder from

all pins of the flat pack-IC. When you use solder

flux which is applied to all pins of the flat pack-IC,

you can remove it easily. (Fig. S-1-3)

2. Lift each lead of the flat pack-IC upward one by

one, using a sharp pin or wire to which solder will

not adhere (iron wire). When heating the pins, use

a fine tip soldering iron or a hot air desoldering

machine. (Fig. S-1-4)

3. Bottom of the flat pack-IC is fixed with glue to the

BOARD; when removing entire flat pack-IC, first

apply soldering iron to center of the flat pack-IC

and heat up. Then remove (glue will be melted).

(Fig. S-1-6)

4. Release the flat pack-IC from the BOARD using

tweezers. (Fig. S-1-6)

Hot-air

Flat Pack-IC

Desoldering

Machine

BOARD

Flat Pack-IC

Tweezers

Masking

Ta p e

Fig. S-1-2

Flat Pack-IC

Desoldering Braid

Soldering Iron

Fig. S-1-3

Fine Tip

Soldering Iron

Sharp

Fig. S-1-4

Toshiba DVR80KF Service Manual

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