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Dell PowerEdge R730xd Deployment Guide

Dell PowerEdge R730xd
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11 Dell EMC Networking with Isilon Front-End Deployment and Best Practices Guide | version 1.0
4 Leaf-spine overview
The connections between leaf and spine switches can be layer 2 (switched) or layer 3 (routed). The terms
layer 3 topology and layer 2 topology in this guide refer to these connections. In both topologies,
downstream connections to servers, storage and other endpoint devices within the racks are layer 2 and
connections to external networks are layer 3.
The following concepts apply to layer 2 and layer 3 leaf-spine topologies:
Each leaf switch connects to every spine switch in the topology.
Servers, storage arrays, edge routers and similar devices always connect to leaf switches, never to
spines.
The layer 2 and layer 3 topologies each use two leaf switches at the top of each rack configured as a Virtual
Link Trunking (VLT) pair. VLT allows all connections to be active while also providing fault tolerance. As
administrators add racks to the data center, two leaf switches configured for VLT are added to each new rack.
The total number of leaf-spine connections is equal to the number of leaf switches multiplied by the number of
spine switches. The bandwidth of the fabric may be increased by adding connections between the leaf and
spine layer as long as the spine layer has the capacity for the additional connections.
Leaf-Spine architecture
4.1 Design considerations
There are many different options regarding the selection of the correct topology that will best fit the needs of
the data center. In this section, the different protocols, topologies, and best practices will be covered. The
main differentiation will be whether the L2/L3 boundary is located at the spine layer or at the leaf layer. When
compared to a layer 3 topology, a layer 2 topology is generally less complex but has some limitations that
must be considered. These include:
For each VLAN, the layer 2 topology creates one large broadcast domain across the fabric. The layer
3 topology has the benefit of containing broadcast domains to each rack.
The layer 2 topology is limited to 4094 VLANs across the fabric. The layer 3 topology allows up to
4094 VLANs per rack.
The layer 2 topology is limited to two physical switches at the spine layer (configured as VLT peers).
In a layer 3 topology, additional spines may be added as needed to provide additional paths and
bandwidth. Therefore, a layer 3 topology is more scalable and is better suited for very large networks.

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Dell PowerEdge R730xd Specifications

General IconGeneral
Tcase72.6 °C
Bus typeQPI
SteppingR2
FSB ParityNo
Scalability2S
Processor codeSR207
Processor cache15 MB
Processor cores6
Processor modelE5-2620V3
System bus rate8 GT/s
Processor seriesIntel Xeon E5-2600 v3
Processor socketLGA 2011-v3
Processor threads12
Processor codenameHaswell
Motherboard chipsetIntel C610
Processor frequency2.4 GHz
Processor cache typeSmart Cache
Processor lithography22 nm
Processor manufacturerIntel
Processor package size52.5 x 45 mm
Processor front side bus- MHz
Processor boost frequency3.2 GHz
Processor operating modes64-bit
ECC supported by processorYes
PCI Express configurationsx4, x8, x16
Supported instruction setsAVX
Thermal Design Power (TDP)85 W
Number of processors installed1
Maximum number of SMP processors2
Maximum number of PCI Express lanes40
Memory types supported by processorDDR4-SDRAM
Memory channels supported by processorQuad
Memory clock speeds supported by processor1600, 1866 MHz
Memory bandwidth supported by processor (max)59 GB/s
Maximum internal memory supported by processor768 GB
HDD size3.5 \
HDD speed7200 RPM
RAID levels0, 1, 5, 6
HDD interfaceSerial ATA, Serial Attached SCSI (SAS)
Total storage capacity4000 GB
Maximum storage capacity99.6 TB
Supported storage drive interfacesSerial ATA
Memory slots24
Internal memory16 GB
Memory clock speed2133 MHz
LAN controllerBroadcom 5720
Cabling technology10/100/1000Base-T(X)
Ethernet interface typeFast Ethernet, Gigabit Ethernet
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Ethernet LAN (RJ-45) ports4
Operating system installed-
Compatible operating systemsMicrosoft Windows Server 2008/2012 SP2, x86/x64 (x64 includes Hyper-VTM )\\r Microsoft Windows Server 2008/2012 R2, x64 (includes Hyper-VTM v2)\\r Microsoft Windows HPC Server 2008\\r Novell SUSE Linux Enterprise Server\\r Red Hat Enterprise Linux\\r VMware ESX
Chassis typeRack (2U)
Power supply750 W
Intel® Virtualization Technology (Intel® VT)VT-d, VT-x
Processor ARK ID83352
Intel Secure Key Technology version1.00
Intel Identity Protection Technology version0.00
PCI Express slots version3.0
On-board graphics card modelNot available
Weight and Dimensions IconWeight and Dimensions
Depth684 mm
Width440 mm
Height87.3 mm

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