3. Thoroughly clean the thermal material from the surfaces of the heat sink and the system board
components each time the heat sink is removed. Replacement thermal material is included with the heat
sink and system board spare part kits.
Thermal paste is used on the integrated system board processor (1) and the heat sink (2).
4. Discrete models: In the order indicated on the heat sink, remove the ve Phillips M2.0 × 2.0 screws (1)
that secure the heat sink to the system board.
5. Remove the heat sink (2).
40 Chapter 5 Removal and replacement procedures for authorized service provider parts
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