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HP ELITE x2 1012 G1 Maintenance And Service Guide

HP ELITE x2 1012 G1
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Packaging and transporting guidelines
Follow these grounding guidelines when packaging and transporting equipment:
To avoid hand contact, transport products in static-safe tubes, bags, or boxes.
Protect ESD-sensitive parts and assemblies with conductive or approved containers or packaging.
Keep ESD-sensitive parts in their containers until the parts arrive at static-free workstations.
Place items on a grounded surface before removing items from their containers.
Always be properly grounded when touching a component or assembly.
Store reusable ESD-sensitive parts from assemblies in protective packaging or nonconductive foam.
Use transporters and conveyors made of antistatic belts and roller bushings. Be sure that mechanized
equipment used for moving materials is wired to ground and that proper materials are selected to avoid
static charging. When grounding is not possible, use an ionizer to dissipate electric charges.
Workstation guidelines
Follow these grounding workstation guidelines:
Cover the workstation with approved static-shielding material.
Use a wrist strap connected to a properly grounded work surface and use properly grounded tools and
equipment.
Use conductive eld service tools, such as cutters, screwdrivers, and vacuums.
When xtures must directly contact dissipative surfaces, use xtures made only of static safe materials.
Keep the work area free of nonconductive materials, such as ordinary plastic assembly aids and
Styrofoam.
Handle ESD-sensitive components, parts, and assemblies by the case or PCM laminate. Handle these
items only at static-free workstations.
Avoid contact with pins, leads, or circuitry.
Turn o power and input signals before inserting or removing connectors or test equipment.
26 Chapter 4 Removal and replacement procedures preliminary requirements

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HP ELITE x2 1012 G1 Specifications

General IconGeneral
Bus typeOPI
SteppingD1
Tjunction100 °C
Processor codeSR2EN
Processor cache4 MB
Processor cores2
Processor familyIntel® Core™ m3
Processor seriesIntel Core m3-6Y series
Processor socketBGA 1515
Processor threads4
Processor codenameSkylake
Processor frequency0.9 GHz
Processor cache typeSmart Cache
Processor manufacturerIntel
Processor package size20 X 16.5 mm
Conflict-Free processorYes
PCI Express slots version3.0
Processor boost frequency2.2 GHz
Processor operating modes32-bit, 64-bit
ECC supported by processorNo
Graphics & IMC lithography14 nm
PCI Express configurations1x2+2x1, 2x2, 1x4, 4x1
Supported instruction setsSSE4.1, SSE4.2, AVX 2.0
Thermal Design Power (TDP)4.5 W
Maximum number of PCI Express lanes10
Device typeTablet PC
Form factorSlate
Product colorSilver
Internal memory4 GB
Memory clock speed1866 MHz
Internal memory typeLPDDR3-SDRAM
Storage mediaSSD
Compatible memory cardsMicroSD (TransFlash)
Internal storage capacity180 GB
Display diagonal12 \
Touch technologyMulti-touch
Display resolution1920 x 1280 pixels
Graphics cardHD Graphics 515
On-board graphics card ID0x191E
On-board graphics card modelIntel® HD Graphics 515
Maximum on-board graphics card memory1.74 GB
On-board graphics card OpenGL version4.4
On-board graphics card base frequency300 MHz
On-board graphics card dynamic frequency (max)850 MHz
Rear camera typeSingle camera
Rear camera resolution (numeric)5 MP
Front camera resolution (numeric)2 MP
Country of originChina
Wi-Fi standards802.11a, Wi-Fi 5 (802.11ac), 802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version4.2
Top Wi-Fi standardWi-Fi 5 (802.11ac)
Battery capacity2800 mAh
Battery life (max)10 h
AC adapter power45 W
USB 2.0 ports quantity0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity1
Sustainability certificatesENERGY STAR
PlatformWindows
Operating system architecture64-bit
Processor ARK ID88198
Intel Secure Key Technology version1.00
Intel Stable Image Platform Program (SIPP) version0.00
Weight and Dimensions IconWeight and Dimensions
Depth213.5 mm
Width300 mm
Height8.05 mm
Weight820 g

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