HP EliteBook 850 G3 User Manual

Grounding guidelines
Electrostatic discharge damage
Electronic components are sensitive to electrostatic discharge (ESD). Circuitry design and structure determine
the degree of sensitivity. Networks built into many integrated circuits provide some protection, but in many
cases, ESD contains enough power to alter device parameters or melt silicon junctions.
A discharge of static electricity from a nger or other conductor can destroy static-sensitive devices or
microcircuitry. Even if the spark is neither felt nor heard, damage may have occurred.
An electronic device exposed to ESD may not be aected at all and can work perfectly throughout a normal
cycle. Or the device may function normally for a while, then degrade in the internal layers, reducing its life
expectancy.
CAUTION: To prevent damage to the computer when you are removing or installing internal components,
observe these precautions:
Keep components in their electrostatic-safe containers until you are ready to install them.
Before touching an electronic component, discharge static electricity by using the guidelines described in this
section.
Avoid touching pins, leads, and circuitry. Handle electronic components as little as possible.
If you remove a component, place it in an electrostatic-safe container.
The following table shows how humidity aects the electrostatic voltage levels generated by dierent
activities.
CAUTION: A product can be degraded by as little as 700 V.
Typical electrostatic voltage levels
Relative humidity
Event 10% 40% 55%
Walking across carpet 35,000 V 15,000 V 7,500 V
Walking across vinyl oor 12,000 V 5,000 V 3,000 V
Motions of bench worker 6,000 V 800 V 400 V
Removing DIPS from plastic tube 2,000 V 700 V 400 V
Removing DIPS from vinyl tray 11,500 V 4,000 V 2,000 V
Removing DIPS from Styrofoam 14,500 V 5,000 V 3,500 V
Removing bubble pack from PCB 26,500 V 20,000 V 7,000 V
Packing PCBs in foam-lined box 21,000 V 11,000 V 5,000 V
32 Chapter 4 Removal and replacement procedures preliminary requirements

HP EliteBook 850 G3 Specifications

General

Form factor	Clamshell
Product type	Ultrabook
Product color	Silver
Country of origin	China
Bus type	OPI
Stepping	D1
Tjunction	100 °C
Processor cache	4 MB
Processor cores	2
Processor model	i7-6500U
System bus rate	4 GT/s
Processor family	Intel® Core™ i7
Processor series	Intel Core i7-6500 Mobile series
Processor socket	LGA 1356 (Socket B2)
Processor threads	4
Processor codename	Skylake
Configurable TDP-up	25 W
Processor frequency	2.5 GHz
Processor cache type	Smart Cache
Configurable TDP-down	7.5 W
Processor lithography	14 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	3.0
Processor boost frequency	3.1 GHz
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x4, 4x1
Thermal Design Power (TDP)	15 W
Configurable TDP-up frequency	2.6 GHz
Configurable TDP-down frequency	0.8 GHz
Maximum number of PCI Express lanes	12
Numeric keypad	Yes
Pointing device	Touchpad
Recovery operating system	Windows 10 Pro
Operating system installed	Windows 7 Professional
Memory slots	2x SO-DIMM
Internal memory	8 GB
Memory clock speed	2133 MHz
Internal memory type	DDR4-SDRAM
Maximum internal memory	16 GB
Memory layout (slots x size)	1 x 4 GB
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
SSD interface	SATA
Storage media	SSD
Total storage capacity	512 GB
Compatible memory cards	SD, SDHC, SDXC
Number of SSDs installed	1
Display diagonal	15.6 \
Native aspect ratio	16:9
On-board graphics card ID	1916
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 520
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	1.74 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	300 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1050 MHz
Battery capacity	46 Wh
Number of battery cells	3
AC adapter power	65 W
Wi-Fi standards	802.11a, Wi-Fi 5 (802.11ac), 802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version	4.2
Top Wi-Fi standard	Wi-Fi 5 (802.11ac)
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Charging port type	DC-in jack
USB 2.0 ports quantity	0
Sustainability certificates	ENERGY STAR
Processor code	SR2EZ
Processor ARK ID	88194
Processor package size	42 X 24 mm
Supported instruction sets	SSE4.1, SSE4.2, AVX 2.0
Intel Smart Response Technology version	1.00
Intel Stable Image Platform Program (SIPP) version	0.00
Intel segment tagging	Enterprise
HP segment	Business
HP Software provided	HP BIOSphere with HP Sure Start, HP Client Security, HP Image Assistant, HP SoftPaq Download Manager, HP Connection Manager, HP Noise Reduction Software, HP Clear Sound Amp

Weight and Dimensions

Depth	257.7 mm
Width	383.3 mm
Height	19.4 mm
Weight	1880 g