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HP ENVY 14 Service Guide

HP ENVY 14
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Drive handling
CAUTION: Drives are fragile components that must be handled with care. To prevent damage to the
computer, damage to a drive, or loss of information, observe these precautions:
Before removing or inserting a hard drive, shut down the computer. If you are unsure whether the
computer is off or in Hibernation, turn the computer on, and then shut it down through the operating
system.
Before handling a drive, be sure that you are discharged of static electricity. While handling a drive,
avoid touching the connector.
Before removing a diskette drive or optical drive, be sure that a diskette or disc is not in the drive and
be sure that the optical drive tray is closed.
Handle drives on surfaces covered with at least one inch of shock-proof foam.
Avoid dropping drives from any height onto any surface.
After removing a hard drive, an optical drive, or a diskette drive, place it in a static-proof bag.
Avoid exposing an internal hard drive to products that have magnetic fields, such as monitors or
speakers.
Avoid exposing a drive to temperature extremes or liquids.
If a drive must be mailed, place the drive in a bubble pack mailer or other suitable form of protective
packaging and label the package “FRAGILE.”
Grounding guidelines
Electrostatic discharge damage
Electronic components are sensitive to electrostatic discharge (ESD). Circuitry design and structure
determine the degree of sensitivity. Networks built into many integrated circuits provide some
protection, but in many cases, ESD contains enough power to alter device parameters or melt silicon
junctions.
A discharge of static electricity from a finger or other conductor can destroy static-sensitive devices or
microcircuitry. Even if the spark is neither felt nor heard, damage may have occurred.
An electronic device exposed to ESD may not be affected at all and can work perfectly throughout a
normal cycle. Or the device may function normally for a while, then degrade in the internal layers,
reducing its life expectancy.
32 Chapter 4 Removal and replacement procedures ENWW

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HP ENVY 14 Specifications

General IconGeneral
Bus typeDMI
SteppingC2
Tjunction105 °C
Processor cache3 MB
Processor cores2
System bus rate2.5 GT/s
Processor familyIntel® Core™ i5
Processor seriesIntel Core i5-500 Mobile Series
Processor socketBGA 956
Processor threads4
Processor codenameArrandale
Processing Die size81 mm²
Processor frequency2.4 GHz
Processor cache typeSmart Cache
Processor lithography32 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version2.0
Processor boost frequency2.93 GHz
Processor operating modes64-bit
ECC supported by processorNo
PCI Express configurations1x16
Thermal Design Power (TDP)35 W
CPU multiplier (bus/core ratio)18
Maximum number of PCI Express lanes16
Number of Processing Die Transistors382 M
Motherboard chipsetIntel® HM55 Express
HDD speed7200 RPM
HDD interfaceSATA
Optical drive typeDVD Super Multi
Card reader integratedYes
Total storage capacity500 GB
Compatible memory cardsMMC, SD
Display diagonal14.5 \
Display resolution1600 x 900 pixels
Native aspect ratio16:9
Memory slots2x SO-DIMM
Internal memory4 GB
Internal memory typeDDR3-SDRAM
Maximum internal memory8 GB
Memory layout (slots x size)2 x 2 GB
Discrete graphics card modelAMD Radeon HD 5650
Maximum graphics card memory2.714 GB
On-board graphics card modelIntel® HD Graphics
On-board graphics card base frequency500 MHz
On-board graphics card dynamic frequency (max)766 MHz
TypePC
Power supply typeAC
Wireless technologyWi-Fi
Graphics card familyAMD
Compliance industry standardsIEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Cabling technology10/100/1000Base-T(X)
Networking featuresGigabit Ethernet
Operating system installedWindows 7 Home Premium
Sustainability certificatesENERGY STAR
AC adapter power90 W
Number of battery cells8
Charging port typeDC-in jack
USB 2.0 ports quantity3
Ethernet LAN (RJ-45) ports1
VGA (D-Sub) ports quantity0
Cable lock slot typeKensington
Product colorBlack
Country of originChina
Pointing deviceTouchpad
Processor ARK ID47341
Processor package sizerPGA 37.5x 37.5, BGA 34x28 mm
Graphics & IMC lithography45 nm
Supported instruction setsSSE4.1/4.2
Intel® Turbo Boost Technology1.0
Physical Address Extension (PAE)36 bit
Weight and Dimensions IconWeight and Dimensions
Depth237 mm
Width356 mm
Weight2380 g
Height (rear)28.2 mm
Height (front)27.7 mm

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