HP Envy 15 User Manual

CAUTION: To prevent damage to the computer when you are removing or installing internal
components, observe these precautions:
Keep components in their electrostatic-safe containers until you are ready to install them.
Before touching an electronic component, discharge static electricity by using the guidelines
described in this section.
Avoid touching pins, leads, and circuitry. Handle electronic components as little as possible.
If you remove a component, place it in an electrostatic-safe container.
The following table shows how humidity affects the electrostatic voltage levels generated by different
activities.
CAUTION: A product can be degraded by as little as 700 V.
Typical electrostatic voltage levels
Relative humidity
Event 10% 40% 55%
Walking across carpet 35,000 V 15,000 V 7,500 V
Walking across vinyl floor 12,000 V 5,000 V 3,000 V
Motions of bench worker 6,000 V 800 V 400 V
Removing DIPS from plastic tube 2,000 V 700 V 400 V
Removing DIPS from vinyl tray 11,500 V 4,000 V 2,000 V
Removing DIPS from Styrofoam 14,500 V 5,000 V 3,500 V
Removing bubble pack from PCB 26,500 V 20,000 V 7,000 V
Packing PCBs in foam-lined box 21,000 V 11,000 V 5,000 V
Grounding guidelines 37

HP Envy 15 Specifications

General

Form factor	Clamshell
Product type	Laptop
Product color	Silver
Country of origin	China
Accelerometer	Yes
Motherboard chipset	Intel SoC
Memory slots	2x SO-DIMM
Internal memory	8 GB
Memory clock speed	2133 MHz
Memory form factor	SO-DIMM
Internal memory type	DDR4-SDRAM
Maximum internal memory	16 GB
Memory layout (slots x size)	2 x 4 GB
3D	No
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
Storage media	SSD
Total storage capacity	256 GB
Compatible memory cards	SD, SDHC, SDXC
Number of SSDs installed	1
Display diagonal	15.6 \
Native aspect ratio	16:9
On-board graphics card ID	0x5916
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 620
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	32 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	300 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1000 MHz
Speakers manufacturer	Bang & Olufsen
Number of built-in speakers	2
Wi-Fi standards	Wi-Fi 5 (802.11ac)
Bluetooth version	4.2
Charging port type	DC-in jack
USB 2.0 ports quantity	0
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity	3
Pointing device	Touchpad
Operating system architecture	64-bit
Battery capacity	52 Wh
Battery life (max)	9 h
AC adapter power	45 W
AC adapter frequency	50 - 60 Hz
AC adapter input voltage	100 - 240 V
Cable lock slot type	Kensington
Package depth	305 mm
Package width	520 mm
Package height	69 mm
Package weight	3510 g
Operating altitude	-15 - 3048 m
Non-operating altitude	-15 - 12192 m
Storage temperature (T-T)	-20 - 60 °C
Operating temperature (T-T)	5 - 35 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	10 - 90 %
Sustainability certificates	EPEAT Silver, ENERGY STAR
Bus type	OPI
Stepping	H0
Tjunction	100 °C
Processor cache	3 MB
System bus rate	4 GT/s
Processor family	Intel® Core™ i5
Processor socket	BGA 1356
Processor threads	4
Processor codename	Kaby Lake
Configurable TDP-up	25 W
Processor frequency	2.5 GHz
Processor cache type	Smart Cache
Configurable TDP-down	7.5 W
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	3.1 GHz
PCI Express configurations	1x2+2x1, 1x4, 2x2, 4x1
Thermal Design Power (TDP)	15 W
Configurable TDP-up frequency	2.7 GHz
Configurable TDP-down frequency	0.8 GHz
Maximum number of PCI Express lanes	12
Processor code	SR2ZU
Processor ARK ID	95443
Processor package size	42 x 24 mm
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Intel Identity Protection Technology version	1.00
Intel Stable Image Platform Program (SIPP) version	0.00

Weight and Dimensions

Depth	255 mm
Width	380 mm
Height	17.9 mm
Weight	1930 g