HP Envy 15 User Manual

3. Remove the mSATA SSD (2) by pulling the drive away from the slot at an angle.
Reverse this procedure to install the mSATA SSD.
WLAN module
Description Spare part number
Broadcom BCM 4352 802.11 ac 2×2 WiFi + Bluetooth 4.0 Combo Adapter (for use on computer
models with an Intel processor, select models only)
724935-001
Intel Dual Band Wireless-AC 3160 802.11 ac 1×1 WiFi + Bluetooth 4.0 Combo Adapter (for use
on computer models with an Intel processor, select models only)
710662-001
Intel Dual Band Wireless 7260 802.11 bgn 2×2 WiFi + Bluetooth 4.0 Combo Adapter (for use on
computer models with an Intel processor)
717384-001
Qualcomm Atheros AR9485 802.11bgn 1×1 WiFi Adapter (select models only) 675794-001
Qualcomm QCA9565 802.11bgn 1×1 WiFi + Bluetooth 4.0 Combo Adapter (select models only) 733476-001
Ralink RT3290LE 802.11bgn 1×1 WiFi + Bluetooth 4.0 Combo Adapter (select models only) 690020-001
Realtek RTL8188EE 802.11bgn 1×1 WiFi Adapter (select models only) 709848-001
CAUTION: To prevent an unresponsive system, replace the wireless module only with a wireless
module authorized for use in the computer by the governmental agency that regulates wireless
devices in your country or region. If you replace the module and then receive a warning message,
remove the module to restore device functionality, and then contact technical support.
Before removing the WLAN module, follow these steps:
1. Turn off the computer. If you are unsure whether the computer is off or in Hibernation, turn the
computer on, and then shut it down through the operating system.
2. Disconnect the power from the computer by unplugging the power cord from the computer.
44 Chapter 5 Removal and replacement procedures for Customer Self-Repair parts

HP Envy 15 Specifications

General

Form factor	Clamshell
Product type	Laptop
Product color	Silver
Country of origin	China
Accelerometer	Yes
Motherboard chipset	Intel SoC
Memory slots	2x SO-DIMM
Internal memory	8 GB
Memory clock speed	2133 MHz
Memory form factor	SO-DIMM
Internal memory type	DDR4-SDRAM
Maximum internal memory	16 GB
Memory layout (slots x size)	2 x 4 GB
3D	No
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
Storage media	SSD
Total storage capacity	256 GB
Compatible memory cards	SD, SDHC, SDXC
Number of SSDs installed	1
Display diagonal	15.6 \
Native aspect ratio	16:9
On-board graphics card ID	0x5916
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 620
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	32 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	300 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1000 MHz
Speakers manufacturer	Bang & Olufsen
Number of built-in speakers	2
Wi-Fi standards	Wi-Fi 5 (802.11ac)
Bluetooth version	4.2
Charging port type	DC-in jack
USB 2.0 ports quantity	0
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity	3
Pointing device	Touchpad
Operating system architecture	64-bit
Battery capacity	52 Wh
Battery life (max)	9 h
AC adapter power	45 W
AC adapter frequency	50 - 60 Hz
AC adapter input voltage	100 - 240 V
Cable lock slot type	Kensington
Package depth	305 mm
Package width	520 mm
Package height	69 mm
Package weight	3510 g
Operating altitude	-15 - 3048 m
Non-operating altitude	-15 - 12192 m
Storage temperature (T-T)	-20 - 60 °C
Operating temperature (T-T)	5 - 35 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	10 - 90 %
Sustainability certificates	EPEAT Silver, ENERGY STAR
Bus type	OPI
Stepping	H0
Tjunction	100 °C
Processor cache	3 MB
System bus rate	4 GT/s
Processor family	Intel® Core™ i5
Processor socket	BGA 1356
Processor threads	4
Processor codename	Kaby Lake
Configurable TDP-up	25 W
Processor frequency	2.5 GHz
Processor cache type	Smart Cache
Configurable TDP-down	7.5 W
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	3.1 GHz
PCI Express configurations	1x2+2x1, 1x4, 2x2, 4x1
Thermal Design Power (TDP)	15 W
Configurable TDP-up frequency	2.7 GHz
Configurable TDP-down frequency	0.8 GHz
Maximum number of PCI Express lanes	12
Processor code	SR2ZU
Processor ARK ID	95443
Processor package size	42 x 24 mm
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Intel Identity Protection Technology version	1.00
Intel Stable Image Platform Program (SIPP) version	0.00

Weight and Dimensions

Depth	255 mm
Width	380 mm
Height	17.9 mm
Weight	1930 g