HP Envy 15 User Manual

Cables and connectors
CAUTION: When servicing the computer, be sure that cables are placed in their proper locations
during the reassembly process. Improper cable placement can damage the computer.
Cables must be handled with extreme care to avoid damage. Apply only the tension required to
unseat or seat the cables during removal and insertion. Handle cables by the connector whenever
possible. In all cases, avoid bending, twisting, or tearing cables. Be sure that cables are routed
in such a way that they cannot be caught or snagged by parts being removed or replaced. Handle flex
cables with extreme care; these cables tear easily.
Drive handling
CAUTION: Drives are fragile components that must be handled with care. To prevent damage to
the computer, damage to a drive, or loss of information, observe these precautions:
Before removing or inserting a hard drive, shut down the computer. If you are unsure whether the
computer is off or in Hibernation, turn the computer on, and then shut it down through the operating
system.
Before handling a drive, be sure that you are discharged of static electricity. While handling a drive,
avoid touching the connector.
Before removing a diskette drive or optical drive, be sure that a diskette or disc is not in the drive and
be sure that the optical drive tray is closed.
Handle drives on surfaces covered with at least one inch of shock-proof foam.
Avoid dropping drives from any height onto any surface.
After removing a hard drive, an optical drive, or a diskette drive, place it in a static-proof bag.
Avoid exposing an internal hard drive to products that have magnetic fields, such as monitors or
speakers.
Avoid exposing a drive to temperature extremes or liquids.
If a drive must be mailed, place the drive in a bubble pack mailer or other suitable form of protective
packaging and label the package “FRAGILE.”
Grounding guidelines
Electrostatic discharge damage
Electronic components are sensitive to electrostatic discharge (ESD). Circuitry design and structure
determine the degree of sensitivity. Networks built into many integrated circuits provide some
protection, but in many cases, ESD contains enough power to alter device parameters or melt silicon
junctions.
A discharge of static electricity from a finger or other conductor can destroy static-sensitive devices or
microcircuitry. Even if the spark is neither felt nor heard, damage may have occurred.
An electronic device exposed to ESD may not be affected at all and can work perfectly throughout a
normal cycle. Or the device may function normally for a while, then degrade in the internal layers,
reducing its life expectancy.
36 Chapter 4 Removal and replacement procedures preliminary requirements

HP Envy 15 Specifications

General

Form factor	Clamshell
Product type	Laptop
Product color	Silver
Country of origin	China
Accelerometer	Yes
Motherboard chipset	Intel SoC
Memory slots	2x SO-DIMM
Internal memory	8 GB
Memory clock speed	2133 MHz
Memory form factor	SO-DIMM
Internal memory type	DDR4-SDRAM
Maximum internal memory	16 GB
Memory layout (slots x size)	2 x 4 GB
3D	No
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
Storage media	SSD
Total storage capacity	256 GB
Compatible memory cards	SD, SDHC, SDXC
Number of SSDs installed	1
Display diagonal	15.6 \
Native aspect ratio	16:9
On-board graphics card ID	0x5916
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 620
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	32 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	300 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1000 MHz
Speakers manufacturer	Bang & Olufsen
Number of built-in speakers	2
Wi-Fi standards	Wi-Fi 5 (802.11ac)
Bluetooth version	4.2
Charging port type	DC-in jack
USB 2.0 ports quantity	0
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity	3
Pointing device	Touchpad
Operating system architecture	64-bit
Battery capacity	52 Wh
Battery life (max)	9 h
AC adapter power	45 W
AC adapter frequency	50 - 60 Hz
AC adapter input voltage	100 - 240 V
Cable lock slot type	Kensington
Package depth	305 mm
Package width	520 mm
Package height	69 mm
Package weight	3510 g
Operating altitude	-15 - 3048 m
Non-operating altitude	-15 - 12192 m
Storage temperature (T-T)	-20 - 60 °C
Operating temperature (T-T)	5 - 35 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	10 - 90 %
Sustainability certificates	EPEAT Silver, ENERGY STAR
Bus type	OPI
Stepping	H0
Tjunction	100 °C
Processor cache	3 MB
System bus rate	4 GT/s
Processor family	Intel® Core™ i5
Processor socket	BGA 1356
Processor threads	4
Processor codename	Kaby Lake
Configurable TDP-up	25 W
Processor frequency	2.5 GHz
Processor cache type	Smart Cache
Configurable TDP-down	7.5 W
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	3.1 GHz
PCI Express configurations	1x2+2x1, 1x4, 2x2, 4x1
Thermal Design Power (TDP)	15 W
Configurable TDP-up frequency	2.7 GHz
Configurable TDP-down frequency	0.8 GHz
Maximum number of PCI Express lanes	12
Processor code	SR2ZU
Processor ARK ID	95443
Processor package size	42 x 24 mm
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Intel Identity Protection Technology version	1.00
Intel Stable Image Platform Program (SIPP) version	0.00

Weight and Dimensions

Depth	255 mm
Width	380 mm
Height	17.9 mm
Weight	1930 g