HP Envy 15 User Manual

Reverse this procedure to install the RTC battery. When installing the disc cell RTC battery, make
sure the “+” sign faces up.
Base enclosure
Description Spare part number
Base enclosure (includes 4 rubber feet, battery lock latch, battery release latch, and RJ-45
cover)
720534-001
Before removing the base enclosure, follow these steps:
1. Turn off the computer. If you are unsure whether the computer is off or in Hibernation, turn the
computer on, and then shut it down through the operating system.
2. Disconnect the power from the computer by unplugging the power cord from the computer.
3. Disconnect all external devices from the computer.
4. Remove the battery (see
Battery on page 41).
5. Remove the service door (see
Service door on page 42).
6. Remove the mSATA SSD (see
mSATA SSD on page 43).
7. Remove the hard drive (see
Hard drive on page 46).
Remove the base enclosure:
1. Remove the front rubber feet (1).
The rubber feet are included in the Rubber Kit, spare part number 720559-001.
2. Remove the seven Phillips PM2.5×5.5 screws (2) in the that secure the base enclosure to
the computer.
Component replacement procedures 53

HP Envy 15 Specifications

General

Form factor	Clamshell
Product type	Laptop
Product color	Silver
Country of origin	China
Accelerometer	Yes
Motherboard chipset	Intel SoC
Memory slots	2x SO-DIMM
Internal memory	8 GB
Memory clock speed	2133 MHz
Memory form factor	SO-DIMM
Internal memory type	DDR4-SDRAM
Maximum internal memory	16 GB
Memory layout (slots x size)	2 x 4 GB
3D	No
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
Storage media	SSD
Total storage capacity	256 GB
Compatible memory cards	SD, SDHC, SDXC
Number of SSDs installed	1
Display diagonal	15.6 \
Native aspect ratio	16:9
On-board graphics card ID	0x5916
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 620
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	32 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	300 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1000 MHz
Speakers manufacturer	Bang & Olufsen
Number of built-in speakers	2
Wi-Fi standards	Wi-Fi 5 (802.11ac)
Bluetooth version	4.2
Charging port type	DC-in jack
USB 2.0 ports quantity	0
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity	3
Pointing device	Touchpad
Operating system architecture	64-bit
Battery capacity	52 Wh
Battery life (max)	9 h
AC adapter power	45 W
AC adapter frequency	50 - 60 Hz
AC adapter input voltage	100 - 240 V
Cable lock slot type	Kensington
Package depth	305 mm
Package width	520 mm
Package height	69 mm
Package weight	3510 g
Operating altitude	-15 - 3048 m
Non-operating altitude	-15 - 12192 m
Storage temperature (T-T)	-20 - 60 °C
Operating temperature (T-T)	5 - 35 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	10 - 90 %
Sustainability certificates	EPEAT Silver, ENERGY STAR
Bus type	OPI
Stepping	H0
Tjunction	100 °C
Processor cache	3 MB
System bus rate	4 GT/s
Processor family	Intel® Core™ i5
Processor socket	BGA 1356
Processor threads	4
Processor codename	Kaby Lake
Configurable TDP-up	25 W
Processor frequency	2.5 GHz
Processor cache type	Smart Cache
Configurable TDP-down	7.5 W
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	3.1 GHz
PCI Express configurations	1x2+2x1, 1x4, 2x2, 4x1
Thermal Design Power (TDP)	15 W
Configurable TDP-up frequency	2.7 GHz
Configurable TDP-down frequency	0.8 GHz
Maximum number of PCI Express lanes	12
Processor code	SR2ZU
Processor ARK ID	95443
Processor package size	42 x 24 mm
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Intel Identity Protection Technology version	1.00
Intel Stable Image Platform Program (SIPP) version	0.00

Weight and Dimensions

Depth	255 mm
Width	380 mm
Height	17.9 mm
Weight	1930 g