HP Pavilion dm4 User Manual

Item Description Spare part number
(1) 35.56 cm (14.0-in), WXGA, HD, BrightView display assembly
NOTE: See
Display assembly components on page 25 for more display assembly
internal component spare part information.
For use in models equipped with WWAN 613667-001
For use in models not equipped with WWAN 608207-001
(2) Keyboards
For use in Brazil 608222-201
For use in English and French Canada 608222-121
For use in Europe, the Middle East, and Asia 608022-B31
For use in France 608022-051
For use in Germany 608022-041
For use in Japan 608022-291
For use in Latin America 608222-161
For use in the Netherlands 608022-DH1
For use in Russia 608222–251
For use in Saudi Arabia 608022-171
For use in South Korea 608222-AD1
For use in Spain 608022-071
For use in Switzerland 608022-BG1
For use in Taiwan 608222-AB1
For use in Thailand 608222-281
For use in Turkey 608022-141
For use in the United Kingdom 608022-031
For use in the United States 608222-001
(3) Top cover (includes Touchpad) 608224-001
(4) Power button board (includes cable) 608226-001
(5) Fingerprint reader board 608225-001
(6) Speaker assembly (includes cable) 608232-001
(7) USB board (includes cable) 608277-001
(8) Power connector cable (includes power connector and cable) 608273-001
(9) System board (includes replacement thermal material)
For use in models equipped with 1 GB of HD5450 discrete graphics memory 616244-001
For use in models equipped with 512 MB of HD5450 discrete graphics memory 608203-001
For use in models equipped with 512 MB of HD5470 discrete graphics memory 621044-001
Computer major components 19

HP Pavilion dm4 Specifications

General

Bus type	DMI
Stepping	C2
Tjunction	105 °C
Processor cache	3 MB
Processor cores	2
System bus rate	2.5 GT/s
Processor family	Intel® Core™ i5
Processor series	Intel Core i5-400 Series
Processor socket	BGA 1288
Processor threads	4
Processor codename	Arrandale
Processing Die size	81 mm²
Processor frequency	2.26 GHz
Processor cache type	Smart Cache
Processor lithography	32 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor boost frequency	2.53 GHz
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x16
Thermal Design Power (TDP)	35 W
CPU multiplier (bus/core ratio)	17
Maximum number of PCI Express lanes	16
Number of Processing Die Transistors	382 M
Motherboard chipset	Intel® HM55 Express
Memory slots	2x SO-DIMM
Internal memory	3 GB
Memory clock speed	1333 MHz
Internal memory type	DDR3-SDRAM
Maximum internal memory	8 GB
Memory layout (slots x size)	1 x 1 + 1 x 2 GB
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi
Card reader integrated	Yes
Total storage capacity	500 GB
Compatible memory cards	Memory Stick (MS), MMC, MS PRO, SD, xD
Number of HDDs installed	1
Display diagonal	14 \
Display brightness	200 cd/m²
Display resolution	1366 x 768 pixels
Native aspect ratio	16:9
Contrast ratio (typical)	500:1
Display response rise/fall	8 ms
Type	PC
LightScribe	-
Disc types supported	CD-R, CD-ROM, CD-RW, DVD+R, DVD+RW, DVD-R, DVD-RAM, DVD-ROM, DVD-RW
Ethernet interface type	Gigabit Ethernet
On-board graphics card model	Intel® HD Graphics
On-board graphics card base frequency	500 MHz
On-board graphics card dynamic frequency (max)	766 MHz
Speakers manufacturer	Altec Lansing
Video capturing speed	24 fps
Front camera resolution	640 x 480 pixels
Wi-Fi standards	802.11b, 802.11g, Wi-Fi 4 (802.11n)
Cabling technology	10/100/1000Base-T(X)
Networking features	Gigabit Ethernet, WLAN
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Charging port type	DC-in jack
Headphone connectivity	3.5 mm
USB 2.0 ports quantity	3
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	0
Pointing device	Touchpad
Operating system installed	Windows 7 Home Premium
Form factor	Clamshell
Product type	Laptop
Country of origin	China
Battery life (max)	- h
Number of battery cells	6
AC adapter power	65 W
Cable lock slot type	Kensington
Processor code	SLBPM
Processor ARK ID	43537
Processor package size	rPGA 37.5x 37.5, BGA 34x28 mm
Graphics & IMC lithography	45 nm
Supported instruction sets	SSE4.1, SSE4.2
Intel® Turbo Boost Technology	1.0
Operating altitude	-15 - 3048 m
Non-operating altitude	-15 - 12192 m
Storage temperature (T-T)	-20 - 60 °C
Operating temperature (T-T)	5 - 35 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	10 - 90 %

Weight and Dimensions

Depth	228 mm
Width	340.8 mm
Weight	1990 g
Height (rear)	32.2 mm
Height (front)	25 mm
Depth (imperial)	8.98 \
Width (imperial)	13.7 \
Height (rear) (imperial)	1.26 \
Height (front) (imperial)	0.98 \