HP Pavilion dm4 User Manual

Item Description Spare part number
For use in models equipped with 1 GB of HD5470 discrete graphics memory 621045-001
For use in models equipped with 512 MB of HD6370 discrete graphics memory 630713-001
For use in models equipped with 1 GB of HD6370 discrete graphics memory 630714-001
For use in models equipped with UMA graphics 608204-001
For use in models equipped with WiMAX and UMA graphics 633863-001
(10) Processor (includes replacement thermal material)
Intel Core i7 processor, Dual Core
●
640M, 2.80Hz (SC turbo up to 3.33-GHz), 4-MB L3 cache 625826-001
● 620M, 2.26-GHz (SC turbo up to 3.33-GHz), 4-MB L3 cache) 587259-001
Intel Core i5 processors, Dual Core
●
580M, 2.66-GHz (SC turbo up to 3.33-GHz), 3-MB L3 cache) 625825-001
● 560M, 2.66-GHz (SC turbo up to 3.2-GHz) 3-MB L3 cache) 625824-001
●
540M, 2.53-GHz, (SC turbo up to 3.06-GHz) 3-MB L3 cache) 594188-001
●
520M, 2.40-GHz (SC turbo up to 2.93-GHz), 3-MB L3 cache) 594187-001
● 480M, 2.66-GHz, 3-MB L3 cache 634693-001
●
460M, 2.53-GHz, 3-MB L3 cache 626039-001
●
450M, 2.40-GHz, 3-MB L3 cache 613585-001
● 430M, 2.26-GHz, 3-MB L3 cache 597624-001
(11) Fan/heatsink assembly (includes replacement thermal material)
For use in models equipped with UMA graphics 608229-001
For use in models equipped with discrete graphics 608231-001
(12) Bluetooth module
NOTE: The Bluetooth module cable is included in the Misc Cable Kit, spare part
number 608227-001.
537921-001
(13) HP un2420 Broadband Module (WWAN) 531993-001
(14) WLAN modules
Atheros AR9285 802.11 a/b/g/n 2x2 WiFi adapter
For use in Canada, the Cayman Islands, Guam, Puerto Rico, the United States, and the
US Virgin Islands
580101-001
20 Chapter 3 Illustrated parts catalog

HP Pavilion dm4 Specifications

General

Bus type	DMI
Stepping	C2
Tjunction	105 °C
Processor cache	3 MB
Processor cores	2
System bus rate	2.5 GT/s
Processor family	Intel® Core™ i5
Processor series	Intel Core i5-400 Series
Processor socket	BGA 1288
Processor threads	4
Processor codename	Arrandale
Processing Die size	81 mm²
Processor frequency	2.26 GHz
Processor cache type	Smart Cache
Processor lithography	32 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor boost frequency	2.53 GHz
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x16
Thermal Design Power (TDP)	35 W
CPU multiplier (bus/core ratio)	17
Maximum number of PCI Express lanes	16
Number of Processing Die Transistors	382 M
Motherboard chipset	Intel® HM55 Express
Memory slots	2x SO-DIMM
Internal memory	3 GB
Memory clock speed	1333 MHz
Internal memory type	DDR3-SDRAM
Maximum internal memory	8 GB
Memory layout (slots x size)	1 x 1 + 1 x 2 GB
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi
Card reader integrated	Yes
Total storage capacity	500 GB
Compatible memory cards	Memory Stick (MS), MMC, MS PRO, SD, xD
Number of HDDs installed	1
Display diagonal	14 \
Display brightness	200 cd/m²
Display resolution	1366 x 768 pixels
Native aspect ratio	16:9
Contrast ratio (typical)	500:1
Display response rise/fall	8 ms
Type	PC
LightScribe	-
Disc types supported	CD-R, CD-ROM, CD-RW, DVD+R, DVD+RW, DVD-R, DVD-RAM, DVD-ROM, DVD-RW
Ethernet interface type	Gigabit Ethernet
On-board graphics card model	Intel® HD Graphics
On-board graphics card base frequency	500 MHz
On-board graphics card dynamic frequency (max)	766 MHz
Speakers manufacturer	Altec Lansing
Video capturing speed	24 fps
Front camera resolution	640 x 480 pixels
Wi-Fi standards	802.11b, 802.11g, Wi-Fi 4 (802.11n)
Cabling technology	10/100/1000Base-T(X)
Networking features	Gigabit Ethernet, WLAN
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Charging port type	DC-in jack
Headphone connectivity	3.5 mm
USB 2.0 ports quantity	3
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	0
Pointing device	Touchpad
Operating system installed	Windows 7 Home Premium
Form factor	Clamshell
Product type	Laptop
Country of origin	China
Battery life (max)	- h
Number of battery cells	6
AC adapter power	65 W
Cable lock slot type	Kensington
Processor code	SLBPM
Processor ARK ID	43537
Processor package size	rPGA 37.5x 37.5, BGA 34x28 mm
Graphics & IMC lithography	45 nm
Supported instruction sets	SSE4.1, SSE4.2
Intel® Turbo Boost Technology	1.0
Operating altitude	-15 - 3048 m
Non-operating altitude	-15 - 12192 m
Storage temperature (T-T)	-20 - 60 °C
Operating temperature (T-T)	5 - 35 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	10 - 90 %

Weight and Dimensions

Depth	228 mm
Width	340.8 mm
Weight	1990 g
Height (rear)	32.2 mm
Height (front)	25 mm
Depth (imperial)	8.98 \
Width (imperial)	13.7 \
Height (rear) (imperial)	1.26 \
Height (front) (imperial)	0.98 \