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HP ProDesk 490 G2 User Manual

HP ProDesk 490 G2
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Preventing electrostatic damage to equipment
Many electronic components are sensitive to ESD. Circuitry design and structure determine the degree of
sensitivity. The following packaging and grounding precautions are necessary to prevent damage to electric
components and accessories.
To avoid hand contact, transport products in static-safe containers such as tubes, bags, or boxes.
Protect all electrostatic parts and assemblies with conductive or approved containers or packaging.
Keep electrostatic sensitive parts in their containers until they arrive at static-free stations.
Place items on a grounded surface before removing them from their container.
Always be properly grounded when touching a sensitive component or assembly.
Avoid contact with pins, leads, or circuitry.
Place reusable electrostatic-sensitive parts from assemblies in protective packaging or conductive
foam.
Personal grounding methods and equipment
Use the following equipment to prevent static electricity damage to equipment:
Wrist straps are flexible straps with a maximum of one-megohm ± 10% resistance in the ground cords.
To provide proper ground, a strap must be worn snug against bare skin. The ground cord must be
connected and fit snugly into the banana plug connector on the grounding mat or workstation.
Heel straps/Toe straps/Boot straps can be used at standing workstations and are compatible with
most types of shoes or boots. On conductive floors or dissipative floor mats, use them on both feet with
a maximum of one-megohm ± 10% resistance between the operator and ground.
Static Shielding Protection Levels
Method Voltage
Antistatic plastic
Carbon-loaded plastic
Metallized laminate
1,500
7,500
15,000
Grounding the work area
To prevent static damage at the work area, use the following precautions:
Cover the work surface with approved static-dissipative material. Provide a wrist strap connected to the
work surface and properly grounded tools and equipment.
Use static-dissipative mats, foot straps, or air ionizers to give added protection.
Handle electrostatic sensitive components, parts, and assemblies by the case or PCB laminate. Handle
them only at static-free work areas.
Turn off power and input signals before inserting and removing connectors or test equipment.
Use fixtures made of static-safe materials when fixtures must directly contact dissipative surfaces.
Keep work area free of nonconductive materials such as ordinary plastic assembly aids and Styrofoam.
Use field service tools, such as cutters, screwdrivers, and vacuums, that are conductive.
18 Chapter 4 Routine care, SATA drive guidelines, and disassembly preparation

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HP ProDesk 490 G2 Specifications

General IconGeneral
Tcase72 °C
Bus typeDMI2
SteppingC0
Processor cache3 MB
Processor cores2
System bus rate5 GT/s
Processor familyIntel® Core™ i3
Processor seriesIntel Core i3-4100 Desktop series
Processor socketLGA 1150 (Socket H3)
Processor threads4
Processor codenameHaswell
Number of QPI links0
Processor frequency3.7 GHz
Processor cache typeL3
Processor lithography22 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version3.0
Processor operating modes32-bit, 64-bit
ECC supported by processorYes
PCI Express configurations1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)54 W
Number of processors installed1
Maximum number of PCI Express lanes16
Memory types supported by processorDDR3-SDRAM, DDR3L-SDRAM
Memory voltage supported by processor1.5 V
Memory clock speeds supported by processor1333, 1600 MHz
Memory bandwidth supported by processor (max)25.6 GB/s
Maximum internal memory supported by processor32 GB
On-board graphics card ID41
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics 4400
On-board graphics card familyIntel® HD Graphics
Maximum on-board graphics card memory1.74 GB
On-board graphics card OpenGL version4.3
On-board graphics card base frequency350 MHz
On-board graphics card DirectX version11.1
On-board graphics card dynamic frequency (max)1150 MHz
Number of displays supported (on-board graphics)3
Memory slots4x DIMM
Internal memory4 GB
Memory channelsDual-channel
Memory clock speed1600 MHz
Internal memory typeDDR3-SDRAM
Memory layout (slots x size)1 x 4 GB
HDD speed7200 RPM
HDD interfaceSATA
Storage mediaHDD
Optical drive typeDVD±RW
Total storage capacity500 GB
Intel segment taggingEnterprise, Small Business
Operating system installedFreeDOS
Operating system architecture64-bit
Wi-FiNo
Cabling technology10/100/1000Base-T(X)
Ethernet LAN data rates10, 100, 1000 Mbit/s
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Chassis typeMicro Tower
Product colorBlack
Country of originChina
Placement supportedVertical
Product typePC
Motherboard chipsetIntel® H97
Power supply180 W
Power supply input voltage100 - 240 V
Power supply input frequency50 - 60 Hz
Operating temperature (T-T)10 - 35 °C
Operating relative humidity (H-H)10 - 90 %
Sustainability certificatesENERGY STAR
Scalability1S
Processor codeSR1PL
Processor ARK ID77490
Processor package size37.5 x 37.5 mm
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
Thermal solution specificationPCG 2013C
Intel Secure Key Technology version1.00
Intel Stable Image Platform Program (SIPP) version0.00
Weight and Dimensions IconWeight and Dimensions
Depth358.8 mm
Width165 mm
Height355 mm
Weight6500 g

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