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HP ProDesk 490 G2 User Manual

HP ProDesk 490 G2
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Installing DIMMs
CAUTION: You must disconnect the power cord and wait approximately 30 seconds for the power to drain
before adding or removing memory modules. Regardless of the power-on state, voltage is always supplied to
the memory modules as long as the computer is plugged into an active AC outlet. Adding or removing
memory modules while voltage is present may cause irreparable damage to the memory modules or system
board.
The memory module sockets have gold-plated metal contacts. When upgrading the memory, it is important
to use memory modules with gold-plated metal contacts to prevent corrosion and/or oxidation resulting
from having incompatible metals in contact with each other.
Static electricity can damage the electronic components of the computer or optional cards. Before beginning
these procedures, ensure that you are discharged of static electricity by briefly touching a grounded metal
object.
When handling a memory module, be careful not to touch any of the contacts. Doing so may damage the
module.
1. Prepare the computer for disassembly (Preparation for disassembly on page 25).
2. Remove the access panel (
Access panel on page 26)
3. Open both latches of the memory module socket (1), and insert the memory module into the socket (2).
In HP ProDesk 490 G2 models, populate the black DIMM sockets before the white DIMM sockets.
NOTE: A memory module can be installed in only one way. Match the notch on the module with the tab
on the memory socket.
For maximum performance, populate the sockets so that the memory capacity is spread as equally as
possible between Channel A and Channel B.
4. Push the module down into the socket, ensuring that the module is fully inserted and properly seated.
Make sure the latches are in the closed position (3).
5. Repeat steps 3 and 4 to install any additional modules.
The computer should automatically recognize the additional memory the next time you turn on the
computer.
Memory 31

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HP ProDesk 490 G2 Specifications

General IconGeneral
Tcase72 °C
Bus typeDMI2
SteppingC0
Processor cache3 MB
Processor cores2
System bus rate5 GT/s
Processor familyIntel® Core™ i3
Processor seriesIntel Core i3-4100 Desktop series
Processor socketLGA 1150 (Socket H3)
Processor threads4
Processor codenameHaswell
Number of QPI links0
Processor frequency3.7 GHz
Processor cache typeL3
Processor lithography22 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version3.0
Processor operating modes32-bit, 64-bit
ECC supported by processorYes
PCI Express configurations1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)54 W
Number of processors installed1
Maximum number of PCI Express lanes16
Memory types supported by processorDDR3-SDRAM, DDR3L-SDRAM
Memory voltage supported by processor1.5 V
Memory clock speeds supported by processor1333, 1600 MHz
Memory bandwidth supported by processor (max)25.6 GB/s
Maximum internal memory supported by processor32 GB
On-board graphics card ID41
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics 4400
On-board graphics card familyIntel® HD Graphics
Maximum on-board graphics card memory1.74 GB
On-board graphics card OpenGL version4.3
On-board graphics card base frequency350 MHz
On-board graphics card DirectX version11.1
On-board graphics card dynamic frequency (max)1150 MHz
Number of displays supported (on-board graphics)3
Memory slots4x DIMM
Internal memory4 GB
Memory channelsDual-channel
Memory clock speed1600 MHz
Internal memory typeDDR3-SDRAM
Memory layout (slots x size)1 x 4 GB
HDD speed7200 RPM
HDD interfaceSATA
Storage mediaHDD
Optical drive typeDVD±RW
Total storage capacity500 GB
Intel segment taggingEnterprise, Small Business
Operating system installedFreeDOS
Operating system architecture64-bit
Wi-FiNo
Cabling technology10/100/1000Base-T(X)
Ethernet LAN data rates10, 100, 1000 Mbit/s
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Chassis typeMicro Tower
Product colorBlack
Country of originChina
Placement supportedVertical
Product typePC
Motherboard chipsetIntel® H97
Power supply180 W
Power supply input voltage100 - 240 V
Power supply input frequency50 - 60 Hz
Operating temperature (T-T)10 - 35 °C
Operating relative humidity (H-H)10 - 90 %
Sustainability certificatesENERGY STAR
Scalability1S
Processor codeSR1PL
Processor ARK ID77490
Processor package size37.5 x 37.5 mm
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
Thermal solution specificationPCG 2013C
Intel Secure Key Technology version1.00
Intel Stable Image Platform Program (SIPP) version0.00
Weight and Dimensions IconWeight and Dimensions
Depth358.8 mm
Width165 mm
Height355 mm
Weight6500 g

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