3. Remove the fan/heat sink assembly (3).
NOTE: Due to the adhesive quality of the thermal material located between the fan/heat sink
assembly and system board components, it may be necessary to move the fan/heat sink
assembly from side to side to detach the assembly.
NOTE: The thermal material should be thoroughly cleaned from the surfaces of the fan/heat sink
assembly (1) and the system board components (2) each time the fan/heat sink assembly is
removed. Replacement thermal material is included with all system board, fan/heat sink assembly,
and processor spare part kits. A separate thermal pad kit is also available using spare part number
634256-001.
Reverse this procedure to install the fan/heat sink assembly.
68 Chapter 4 Removal and replacement procedures
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