Intel E7500 MCH User Manual

4 Thermal Design Guide
Contents
Figures
1 Thermal Design Process ..............................................................................................................5
2Intel
®
E7500 and Intel
®
E7501 Chipsets MCH Package Dimensions ..........................................7
3 90° Angle Attach Methodology ...................................................................................................14
4 0° Angle Attach Methodology .....................................................................................................15
5 0° Angle Attach Heat Sink Modifications ....................................................................................15
6 Thermal Solution Decision Flowchart.........................................................................................16
7 Theta ja versus Airflow for the Reference Thermal Solution ......................................................18
8 Reference Heat Sink Volumetric Envelope for the MCH ............................................................19
9 Reference Thermal Solution Assembly Using Retention Method A ...........................................20
10 Heat Sink Retention Mechanism Layout for Retention Method A ..............................................21
11 Retention Mechanism Component Keep-out Zones for Retention Method A.............................21
12 Reference Thermal Solution Assembly Using Retention Method B ...........................................22
13 Board Component Keep-out for Retention Method B.................................................................23
14 Heat Sink Mechanical Gasket, Optional Two-Piece ...................................................................24
15 MCH Heat Sink...........................................................................................................................32
16 Heat Sink Clip.............................................................................................................................33
17 Push-pin .....................................................................................................................................34
Tables
1 Definition of Terms .......................................................................................................................6
2 Reference Documents..................................................................................................................6
3Intel
®
E7500 and Intel
®
E7501 Chipsets MCH Thermal Specifications .....................................11
4 Theta ja Required versus Device and Configuration..................................................................17
5 Reliability Requirements.............................................................................................................25
6 Mechanical Drawing List.............................................................................................................31
Revision History
Date Revision Description
March 2003 002
Revised Table 3, “Intel
®
E7500 and Intel
®
E7501 Chipsets
MCH Thermal Specifications.”
Revised Table 4, “Theta ja Required versus Device and
Configuration.”
November 2002 001 Initial release of this document.

Intel E7500 MCH Specifications

General

Brand	Intel
Model	E7500 MCH
Category	Controller
Language	English