Thermal Specifications
94 Quad-Core Intel® Xeon® Processor 5300 Series Datasheet
Notes:
1. These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified I
CC
. Please refer to the loadline specifications in Section 2.
2. Maximum Power is the highest power the processor will dissipate, regardless of its VID. Maximum Power is
measured at maximum T
CASE
.
3. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
4. These specifications are based on silicon characterization.
5. Power specifications are defined at all VIDs found in Table 2-3. The Quad-Core Intel® Xeon® Processor
L5300 Series may be shipped under multiple VIDs for each frequency.
6. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Table 6-7. Quad-Core Intel® Xeon® Processor X5365 Series Thermal Profile (Sheet 1 of
2)
Power (W) T
CASE_MAX
(° C)
P
_PROFILE_MIN
=50 44.3
55 45.3
60 46.2
65 47.1
70 48.1
75 49.0
80 49.9
85 50.9
90 51.8
95 52.7
100 53.7
105 54.6
110 55.5
115 56.5
120 57.4
125 58.3
130 59.3
135 60.2
140 61.1
145 62.1
150 63.0
Table 6-8. Quad-Core Intel® Xeon® Processor L5300 Series Thermal Specifications
Core
Frequency
Maximum Power
(W)
Thermal Design
Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB 65 50 5 See Figure 6-4;
Table 6-9
1, 2, 3, 4, 5, 6