Table of Contents
Baseband System Module..................................................................................................................................... 5–5
Overview ........................................................................................................................................................... 5–5
Introduction: phone description .................................................................................................................... 5–5
Chipset and key components .......................................................................................................................... 5–6
BB block diagram ............................................................................................................................................. 5–7
Baseband functional description.................................................................................................................... 5–8
Baseband functional description............................................................................................................... 5–8
System power up ........................................................................................................................................ 5–9
Modes of operation.................................................................................................................................. 5–12
Power distribution................................................................................................................................... 5–12
Clocking concept....................................................................................................................................... 5–14
Audio concept........................................................................................................................................... 5–14
Baseband electrical interfaces: Battery ................................................................................................. 5–16
Baseband electrical interfaces: Charger................................................................................................. 5–16
Baseband electrical interfaces: Display(s) ............................................................................................. 5–17
Baseband electrical interfaces: Memory................................................................................................ 5–18
Baseband electrical interfaces: SIM........................................................................................................ 5–19
Baseband electrical interface: Dual SIM (for RM-761 only) .................................................................. 5–20
Baseband electrical interfaces: Audio components.............................................................................. 5–21
Baseband electrical interfaces: Backlight and illumination ................................................................ 5–21
Baseband electrical interfaces: Keyboard.............................................................................................. 5–22
Baseband electrical interfaces: Camera................................................................................................. 5–22
Baseband electrical interfaces: Memory card........................................................................................ 5–23
Baseband electrical interfaces: Vibrator................................................................................................ 5–23
Baseband electrical interfaces: BT module............................................................................................ 5–24
RF System Module............................................................................................................................................... 5–24
Overview ........................................................................................................................................................ 5–24
RF general description.................................................................................................................................. 5–24
Frequency plan .............................................................................................................................................. 5–24
Regulators and power supply concept........................................................................................................ 5–25
RF block diagram........................................................................................................................................... 5–26
BOM release version and RF part list ........................................................................................................... 5–28
List of Tables
Table 3 Chipset key components ......................................................................................................................... 5–6
Table 4 Quantum Frequency Plan..................................................................................................................... 5–25
Table 5 Power supply voltages for the X-GOLD213 IC RF sub-system ........................................................... 5–25
Table 6 Schematic differences between releases ........................................................................................... 5–28
List of Figures
Figure 48 Quantum block diagram...................................................................................................................... 5–7
Figure 49 Power up timing and system sleep................................................................................................. 5–10
Figure 50 System startup, SW view .................................................................................................................. 5–11
Figure 51 X-GOLD213 power management unit ............................................................................................. 5–12
Figure 52 Power supply distribution................................................................................................................ 5–13
Figure 53 XG213 clock generation and distribution....................................................................................... 5–14
Figure 54 X-Gold213 audio output selection................................................................................................... 5–15
Figure 55 Dual and single speaker configurations ......................................................................................... 5–15
RM-761; RM-799; RM-800
System Module
Issue 1 COMPANY CONFIDENTIAL Page 5 – 3
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