Some chassis components may have sharp edges.
Be careful when disassembling and servicing.
8 Operation Checks and Main Component Replacement
Procedures
“ATTENTION SERVICER”
1.
This section describes procedures for checking the operation of the major printed circuit boards and replacing the
main components.
2.
For reassembly after operation checks or replacement, reverse the respective procedures.
Special reassembly procedures are described only when required.
3.
Select items from the following index when checks or replacement are required.
Contents
•
Disassembly and assembly main unit
1. Checking of the Main, Panel, Deck and Power P.C.B.
•
Main Component Replacement Procedures
1. Replacement of the Traverse Deck.
2. Replacement of the Power Amplifier IC.
•
Disassembly and assembly of the Traverse Unit
•
Disassembly and assembly of the Disc Tray
Warning:
This product uses a laser diode. Refer to caution statement Precaution of Laser Diode.
ACHTUNG:
Die Lasereinheit nicht zerlegen.
Die Lasereinheit darf nur gegen eine vom Hertsteller spezifizierte Einheit ausgetauscht werden.
8
SA-AK52
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