Sony SA-WSF200 User Manual

66
HCD-F200/F500
SECTION 8
ELECTRICAL PARTS LIST
CENTER BOARD
*************
< CONNECTOR >
CN851 1-784-869-51 CONNECTOR, FFC (LIF (NON-ZIF)) 17P
CN852 1-784-376-51 CONNECTOR, FFC/FPC 17P
************************************************************
9
A-1545-114-A DMB-FIT BOARD, COMPLETE (for SERVICE)
(F200: AEP, UK)
9 A-1545-115-A DMB-FIT BOARD, COMPLETE (for SERVICE)
(F200: SP, TH)
9 A-1545-116-A DMB-FIT BOARD, COMPLETE (for SERVICE)
(F500: RU)
9 A-1545-117-A DMB-FIT BOARD, COMPLETE (for SERVICE)
(F500: CND)
9 A-1545-118-A DMB-FIT BOARD, COMPLETE (for SERVICE)
(F500: SP, TW, TH)
9 A-1545-120-A DMB-FIT BOARD, COMPLETE (for SERVICE)
(F500: KR)
9 A-1545-121-A DMB-FIT BOARD, COMPLETE (for SERVICE)
(F500: E3, E15)
9 A-1545-122-A DMB-FIT BOARD, COMPLETE (for SERVICE)
(F500: AUS)
9 A-1545-123-A DMB-FIT BOARD, COMPLETE (for SERVICE)
(F500: E32)
9 A-1545-124-A DMB-FIT BOARD, COMPLETE (for SERVICE)
(F500: MX)
***********************
< CAPACITOR >
C101 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C102 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C105 1-128-994-21 ELECT CHIP 47uF 20% 10V
C106 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C108 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C109 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C111 1-126-206-11 ELECT CHIP 100uF 20% 6.3V
C112 1-128-994-21 ELECT CHIP 47uF 20% 10V
C113 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C114 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C115 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C116 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C117 1-128-994-21 ELECT CHIP 47uF 20% 10V
C118 1-128-994-21 ELECT CHIP 47uF 20% 10V
C119 1-128-994-21 ELECT CHIP 47uF 20% 10V
C120 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C121 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C122 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C123 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C124 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C125 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C126 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C127 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C129 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V
C130 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C132 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C133 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C135 1-164-677-11 CERAMIC CHIP 0.033uF 10% 16V
C136 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C137 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C138 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C139 1-162-919-11 CERAMIC CHIP 22PF 5% 50V
C140 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C141 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C144 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C145 1-124-779-00 ELECT CHIP 10uF 20% 16V
C146 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C147 1-165-176-11 CERAMIC CHIP 0.047uF 10% 16V
C148 1-165-176-11 CERAMIC CHIP 0.047uF 10% 16V
C149 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C151 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C152 1-162-916-11 CERAMIC CHIP 12PF 5% 50V
C153 1-162-917-11 CERAMIC CHIP 15PF 5% 50V
C154 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C155 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C156 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C158 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C159 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C160 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C161 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C162 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C163 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
DMB-FIT
When indicating parts by reference num-
ber, please include the board name.
Note:
• Due to standardization, replacements in
the parts list may be different from the
parts specifi ed in the diagrams or the com-
ponents used on the set.
• -XX and -X mean standardized parts, so
they may have some difference from the
original one.
• Items marked “*” are not stocked since
they are seldom required for routine ser-
vice. Some delay should be anticipated
when ordering these items.
• CAPACITORS
uF: µF
• COILS
uH: µH
• RESISTORS
All resistors are in ohms.
METAL: Metal-fi lm resistor.
METAL OXIDE: Metal oxide-fi lm resistor.
F: nonfl ammable
• SEMICONDUCTORS
In each case, u: µ, for example:
uA. . : µA. . , uPA. . , µPA. . ,
uPB. . : µPB. . , uPC. . , µPC. . ,
uPD. . : µPD. .
• Abbreviation
AUS : Australian model
CND : Canadian model
E3 : 240V AC area in E model
E15 : Iranian model
E32 : Latin American model
(110 – 240V AC area)
EA : Saudi Arabia model
KR : Korean model
MX : Mexican model
RU : Russian model
SP : Singapore model
TH : Thai model
TW : Taiwan model
The components identifi ed by mark 0
or dotted line with mark 0 are critical for
safety.
Replace only with part number specifi ed.
Les composants identifi és par une marque
0 sont critiques pour la sécurité.
Ne les remplacer que par une pièce portant
le numéro spécifi é.
The components identifi ed by mark 9 con-
tain confi dential information.
Strictly follow the instructions whenever the
components are repaired and/or replaced.
Les composants identifi és par la marque
9 contiennent des informations confi den-
tielles.
Suivre scrupuleusement les instructions
chaque fois qu’un composant est remplacé
et / ou réparé.
CENTER
Ver. 1.1

Sony SA-WSF200 Specifications

General

Brand	Sony
Model	SA-WSF200
Category	Speaker System
Language	English