ST STM32F407 Series User Manual

Recommended PCB routing guidelines for STM32F4xxxx devices AN4488
42/50 AN4488 Rev 7
Figure 25. Via fan-out
Figure 26. FMC signal fan-out routing example
8.5.2 WLCSP143 0.4 mm pitch design example
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Table 10. Wafer level chip scale package information
Package information (mm) Design parameters (mm)
Bump pitch : 0.4 Microvia size : hole size ∅= 0.1, via land: 0.2
Bump size : 0.25 Trace width/space : 0.07/0.05 or 0.07/0.07
Number of rows/columns : 13x11 Bump pad size ∅= 0.26 max – 0.22 recommended
Non-solder mask defined via underbump
allowed
Solder mask opening bump ∅=0.3 min (for 0.26
diameter pad)

ST STM32F407 Series Specifications

General

Brand	ST
Model	STM32F407 Series
Category	Motherboard
Language	English