Contents
1 Board Overview ................................................................................................................... 4
1.1 Kit Contents................................................................................................................... 5
1.2 Using the Connected LaunchPad ......................................................................................... 5
1.3 Features....................................................................................................................... 5
1.4 BoosterPacks................................................................................................................. 6
1.5 Energīa........................................................................................................................ 6
1.6 Specifications................................................................................................................. 6
2 Hardware Description ........................................................................................................... 7
2.1 Functional Description ...................................................................................................... 7
2.1.1 Microcontroller....................................................................................................... 7
2.1.2 Ethernet Connectivity............................................................................................... 8
2.1.3 USB Connectivity ................................................................................................... 8
2.1.4 Motion Control....................................................................................................... 8
2.1.5 User Switches and LED's.......................................................................................... 8
2.1.6 BoosterPacks and Headers ....................................................................................... 9
2.2 Power Management........................................................................................................ 17
2.2.1 Power Supplies.................................................................................................... 17
2.2.2 Low Power Modes ................................................................................................ 18
2.2.3 Clocking ............................................................................................................ 18
2.2.4 Reset................................................................................................................ 18
2.3 Debug Interface............................................................................................................. 18
2.3.1 In-Circuit Debug Interface (ICDI)................................................................................ 18
2.3.2 External Debugger ................................................................................................ 19
2.3.3 Virtual COM Port .................................................................................................. 19
3 Software Development ........................................................................................................ 20
3.1 Software Description....................................................................................................... 20
3.2 Source Code................................................................................................................ 20
3.3 Tool Options ................................................................................................................ 20
3.4 Programming the Connected LaunchPad............................................................................... 21
4 References, PCB Layout, and Bill of Materials ....................................................................... 22
4.1 References.................................................................................................................. 22
4.2 Component Locations ..................................................................................................... 23
4.3 Bill of Materials ............................................................................................................. 24
5 Schematic ......................................................................................................................... 26
6 Revision History................................................................................................................. 27
2
Contents SPMU365A–March 2014–Revised March 2014
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