Ublox ODIN-W2 Series User Manual

ODIN-W2 series - System integration manual
UBX-14040040 - R20 Contents Page 4 of 43
C1-Public
2.3 Flashing an Arm Mbed application ........................................................................................................ 21
2.3.1 ROM based bootloader .................................................................................................................... 21
2.3.2 SWD/JTAG debugger ...................................................................................................................... 22
3 Design-in ............................................................................................................................................. 23
3.1 Overview ...................................................................................................................................................... 23
3.2 Antenna interface design ........................................................................................................................ 23
3.2.1 Antenna connectors ......................................................................................................................... 23
3.2.2 Internal antenna design .................................................................................................................. 24
3.3 Supply interfaces ...................................................................................................................................... 24
3.3.1 Module supply design ...................................................................................................................... 24
3.3.2 Generic digital interfaces supply output (V_INT) design .......................................................... 25
3.4 Data communication interfaces ............................................................................................................ 25
3.4.1 Asynchronous serial interface (UART) design ............................................................................ 25
3.4.2 Ethernet (RMII+SMI) ........................................................................................................................ 25
3.5 Other interface and notes ....................................................................................................................... 25
3.5.1 Low power clock (LPO_CLK) design .............................................................................................. 25
3.6 General High Speed layout guidelines .................................................................................................. 25
3.6.1 General considerations for schematic design and PCB floor-planning ................................. 26
3.6.2 Module placement ............................................................................................................................ 26
3.6.3 Layout and manufacturing ............................................................................................................. 26
3.7 Module footprint and paste mask ......................................................................................................... 27
3.8 Thermal guidelines ................................................................................................................................... 27
3.8.1 Thermal protection ........................................................................................................................... 28
3.8.2 Heat dissipation ................................................................................................................................ 28
3.9 ESD guidelines ........................................................................................................................................... 28
3.10 Schematic for ODIN-W2 .......................................................................................................................... 28
4 Handling and soldering ................................................................................................................... 30
4.1 Packaging, shipping, storage and moisture preconditioning .......................................................... 30
4.2 Handling ...................................................................................................................................................... 30
4.3 Soldering ..................................................................................................................................................... 31
4.3.1 Solder paste ....................................................................................................................................... 31
4.3.2 Reflow soldering ................................................................................................................................ 31
4.3.3 Optical inspection ............................................................................................................................. 32
4.3.4 Cleaning .............................................................................................................................................. 32
4.3.5 Repeated reflow soldering .............................................................................................................. 33
4.3.6 Wave soldering .................................................................................................................................. 33
4.3.7 Hand soldering .................................................................................................................................. 33
4.3.8 Rework ................................................................................................................................................ 33
4.3.9 Conformal coating ............................................................................................................................ 33
4.3.10 Casting ................................................................................................................................................ 33
4.3.11 Grounding metal covers .................................................................................................................. 33
4.3.12 Use of ultrasonic processes ........................................................................................................... 33

Ublox ODIN-W2 Series Specifications

General

Brand	Ublox
Model	ODIN-W2 Series
Category	Control Unit
Language	English