Dell PowerEdge R510 Technical Guide

Dell
PowerEdge R510 Technical Guide 11
2 New Technologies
A number of new technologies have been incorporated into the PowerEdge R510 product, including:
 Intel 5500 chipset + Intel Xeon processor 5500 and 5600 series (new Intel architecture)
 PCIe Generation 2
 DDR3 Memory Technology (Memory RAS feature—mirroring and sparing)
 LVDIMM memory support with Intel Xeon processors 5600 series
 iDRAC6 (Dell server remote management controller)
 Dell Management Console (provides a consolidated view of the IT environment)Virtualization
(supports various virtualization applications)
 SSD advantage (support of SSD drives)
2.1 Detailed Information
2.1.1 Intel Xeon Processor 5500 and 5600 Series
Intel Xeon processor 5500 and 5600 series are the latest generation Intel processors for two-socket servers.
Based on a new 45nm die technology, they use integrated memory controllers on the processor itself rather
than a separate memory controller. QuickPath interconnect technology, the speed of which varies with the
processor model, replaces the familiar front-side bus.
Figure 1. Intel Xeon Processors 5500 and 5600 Series
Other Intel technologies used include:
• Intel Hyper-Threading, which enables more software threads to be running simultaneously.
• Intel Intelligent Power, which scales server power consumption to performance needs.
• Intel Turbo Boost, which boosts frequency for active cores by up to 400 MHz for during peak demand
periods.
2.1.2 Intel 5500 Chipset
Although the chipset supports up to 18 DIMMs, the PowerEdge R510 is designed with 8 DIMM slots. For more
information on the Intel 5500 chipset, see Section 8,
2.2 Sparing
Intel has added sparing back with Xeon processor 5600 series. In sparing mode, you must have identical
memory in Channel_0, Channel_1 and Channel_2. For the R510, memories are installed in A1, A2 and A3 to
enable the sparing mode. With sparing mode is enabled, usable memory capacity is 2/3 of the physical
memory installed.

Dell PowerEdge R510 Specifications

General

HDD size	3.5 \
Hot-swap	Yes
HDD capacity	450 GB
HDD interface	Serial Attached SCSI (SAS)
Total storage capacity	900 GB
Number of HDDs installed	2
Number of HDDs supported	8
Internal memory	4 GB
Memory clock speed	1066 MHz
Internal memory type	DDR3-SDRAM
Maximum internal memory	64 GB
Tcase	76 °C
Bus type	QPI
Stepping	D0
FSB Parity	No
Processor code	SLBF6
Processor cache	8 MB
Processor cores	4
Processor model	E5540
System bus rate	5.86 GT/s
Processor series	Intel Xeon 5500 Series
Processor socket	Socket B (LGA 1366)
Processor codename	Nehalem EP
Motherboard chipset	Intel® 5500
Processing Die size	263 mm²
Processor frequency	2.53 GHz
Processor cache type	Smart Cache
Processor lithography	45 nm
Processor system type	DP
Processor manufacturer	Intel
Processor package size	42.5 x 45 mm
Processor front side bus	- MHz
Processor boost frequency	2.8 GHz
Processor operating modes	64-bit
Thermal Design Power (TDP)	80 W
CPU multiplier (bus/core ratio)	19
Number of Processing Die Transistors	731 M
Memory channels supported by processor	Triple
Memory clock speeds supported by processor	800, 1066 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	144 GB
PS/2 ports quantity	0
Serial ports quantity	1
USB 2.0 ports quantity	6
Display	LCD
L1 cache	0.064 MB
Form factor	-
Graphics card	G200eW
Dimensions (WxDxH)	86.4 x 436.6 x 609.6 mm
Compatible operating systems	Microsoft Windows Small Business Server 2008/2003/ Novell SUSE Linux Enterprise Server 11/10 SP2 Linux Red Hat Enterprise 5.3/4.7 VMware vSphere Version 4.0 VMware ESX v3.5 / ESXi v3.5
Power consumption (typical)	1100 W
Noise level	42 dB
Chassis type	Rack (2U)
PCI Express x4 slots	3
Processor ARK ID	37104
Intel® Turbo Boost Technology	1.0

Weight and Dimensions

Weight	13500 g