Dell PowerEdge T410 User Manual

108 Installing System Components
Memory Mirroring Support
The system supports memory mirroring if identical memory modules are
installed in the two channels closest to the processor (memory should not be
installed in the farthest channel). Mirroring must be enabled in the System
Setup program. In a mirrored configuration, the total available system memory
is one-half of the total installed physical memory.
Optimizer (Independent Channel) Mode
In this mode, all three channels are populated with identical memory
modules. This mode permits a larger total memory capacity but does not
support SDDC with x8-based memory modules.
A minimal single-channel configuration of one 1-GB memory module per
processor is also supported in this mode.
Table 3-1 and Table 3-2 show sample memory configurations that follow the
appropriate memory guidelines stated in this section. The samples show
identical memory-module configurations and their the physical and available
memory totals. The tables do not show mixed or quad-rank memory-module
configurations, nor do they address the memory speed considerations of any
configuration.
Table 3-1. Sample RDIMM Single- and Dual-Rank Memory Configurations (Per
Processor)
Memory
Mode
Memory
Module
Size
Memory
Sockets
Single Processor Dual Processor
4123Physical
Memory
(GB)
Available
Memory
(GB)
Physical
Memory
(GB)
Available
Memory
(GB)
Optimizer 1-GB
X
X
X
X
X
X
X
X
X
X
X
X
1
2
3
2
4
all 2
4
6
4
8
all
book.book Page 108 Tuesday, June 9, 2009 4:09 PM

Dell PowerEdge T410 Specifications

General

Tcase	77.6 °C
Bus type	QPI
Stepping	B1
FSB Parity	No
Processor code	SLBV4
Processor cache	12 MB
Processor cores	4
Processor model	E5620
System bus rate	5.86 GT/s
Processor series	Intel Xeon 5600 Series
Processor socket	Socket B (LGA 1366)
Processor threads	8
Processor codename	Westmere EP
Motherboard chipset	Intel® 5500
Number of QPI links	2
Processor frequency	2.4 GHz
Processor cache type	Smart Cache
Processor lithography	32 nm
Processor manufacturer	Intel
Processor package size	42.5 X 45 mm
Processor front side bus	- MHz
Processor boost frequency	2.66 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
Supported instruction sets	SSE4.2
Thermal Design Power (TDP)	80 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	18
Physical Address Extension (PAE)	40 bit
Memory types supported by processor	DDR3 800/1066
Memory channels supported by processor	Triple
Memory clock speeds supported by processor	800, 1066 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	288 GB
HDD size	3.5 \
Optical drive type	DVD-RW
Total storage capacity	250 GB
Maximum storage capacity	12 TB
Number of HDDs supported	6
Memory slots	8x DIMM
Internal memory	4 GB
Memory clock speed	1066 MHz
Internal memory type	DDR3-SDRAM
Maximum internal memory	16 GB
Maximum graphics card memory	8 MB
Graphics card	G200eW
Dimensions (W x D x H) (imperial)	8.58 x 24.28 x 17.52 \
Networking features	Gigabit Ethernet
PS/2 ports quantity	0
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Number of power supply units	-
Compatible operating systems	Microsoft SQL Server 2008 R2/Windows Small Business Server 2008/Essential Business Server 2008/Server 2008 SP2, x86/x64/Server 2008 R2/HPC Server 2008; Novell SUSE Linux Enterprise Server; Red Hat Enterprise Linux.
Chassis type	Tower
Processor ARK ID	47925
Intel® Turbo Boost Technology	1.0

Weight and Dimensions

Depth	616.8 mm
Width	217.9 mm
Height	444.9 mm