Dell PowerEdge T410 User Manual

110 Installing System Components
1. Requires x4- or x8-based memory modules.
Installing Memory Modules
WARNING: Only trained service technicians are authorized to remove the system
cover and access any of the components inside the system. Before you begin this
procedure, review the safety instructions that came with the system.
WARNING: The memory modules are hot to the touch for some time after the
system has been powered down. Allow time for the memory modules to cool
before handling them. Handle the memory modules by the card edges and avoid
touching the components on the memory module.
CAUTION: To ensure proper system cooling, memory-module blanks must be
installed in any memory socket that is not occupied. Remove memory-module
blanks only if you intend to install memory in those sockets.
1 Turn off the system, including any attached peripherals, and disconnect
the system from the electrical outlet and peripherals.
2 Rotate the system feet inward and lay the system on a flat surface.
Table 3-2. Sample UDIMM Memory Configurations (Per Processor)
Memory
Mode
Memory
Module
Size
Memory
Sockets
Single Processor Dual Processor
4 1 2 3 Physical
Memory
(GB)
Available
Memory
(GB)
Physical
Memory
(GB)
Available
Memory
(GB)
Optimizer 1-GB
X
X
X
X
X
X
X
X
X
X
1
2
3
4
all 2
4
6
8
all
2-GB
X
X
X
X
X
X
X
X
X
X
2
4
6
8
all 4
8
12
16
all
Advanced
ECC
1
1-GB XX 2 all 4 all
2-GB XX 4 all 8 all
Mirroring 1-GB XX 2142
2-GB XX 4284
book.book Page 110 Tuesday, June 9, 2009 4:09 PM

Dell PowerEdge T410 Specifications

General

Tcase	77.6 °C
Bus type	QPI
Stepping	B1
FSB Parity	No
Processor code	SLBV4
Processor cache	12 MB
Processor cores	4
Processor model	E5620
System bus rate	5.86 GT/s
Processor series	Intel Xeon 5600 Series
Processor socket	Socket B (LGA 1366)
Processor threads	8
Processor codename	Westmere EP
Motherboard chipset	Intel® 5500
Number of QPI links	2
Processor frequency	2.4 GHz
Processor cache type	Smart Cache
Processor lithography	32 nm
Processor manufacturer	Intel
Processor package size	42.5 X 45 mm
Processor front side bus	- MHz
Processor boost frequency	2.66 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
Supported instruction sets	SSE4.2
Thermal Design Power (TDP)	80 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	18
Physical Address Extension (PAE)	40 bit
Memory types supported by processor	DDR3 800/1066
Memory channels supported by processor	Triple
Memory clock speeds supported by processor	800, 1066 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	288 GB
HDD size	3.5 \
Optical drive type	DVD-RW
Total storage capacity	250 GB
Maximum storage capacity	12 TB
Number of HDDs supported	6
Memory slots	8x DIMM
Internal memory	4 GB
Memory clock speed	1066 MHz
Internal memory type	DDR3-SDRAM
Maximum internal memory	16 GB
Maximum graphics card memory	8 MB
Graphics card	G200eW
Dimensions (W x D x H) (imperial)	8.58 x 24.28 x 17.52 \
Networking features	Gigabit Ethernet
PS/2 ports quantity	0
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Number of power supply units	-
Compatible operating systems	Microsoft SQL Server 2008 R2/Windows Small Business Server 2008/Essential Business Server 2008/Server 2008 SP2, x86/x64/Server 2008 R2/HPC Server 2008; Novell SUSE Linux Enterprise Server; Red Hat Enterprise Linux.
Chassis type	Tower
Processor ARK ID	47925
Intel® Turbo Boost Technology	1.0

Weight and Dimensions

Depth	616.8 mm
Width	217.9 mm
Height	444.9 mm