Dell PowerEdge T710 User Manual

100 Installing System Components
Memory Mirroring Support
The system supports memory mirroring if identical memory modules are
installed in the two channels closest to the processor (memory should not be
installed in the farthest channel). Mirroring must be enabled in the System
Setup program. In a mirrored configuration, the total available system memory
is one-half of the total installed physical memory.
Optimizer (Independent Channel) Mode
In this mode, all three channels are populated with identical memory
modules. This mode permits a larger total memory capacity but does not
support SDDC with x8-based memory modules.
A minimal single-channel configuration of one 1-GB memory module per
processor is also supported in this mode.
Table 3-1 and Table 3-2 show sample memory configurations that follow the
appropriate memory guidelines stated in this section. The samples show
identical memory-module configurations and their the physical and available
memory totals. The tables do not show mixed or quad-rank memory-module
configurations, nor do they address the memory speed considerations of any
configuration.
Table 3-1. Sample RDIMM Single- and Dual-Rank Memory Configurations (Per
Processor)
Memory
Mode
Memory
Module
Size
Memory Sockets Single Processor Dual Processor
1
4
7
2
5
8
3
6
9
Physical
Memory
(GB)
Available
Memory
(GB)
Physical
Memory
(GB)
Available
Memory
(GB)
Optimizer 2-GB X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
XX
2
4
6
4
8
12
12
18
all 4
8
12
8
16
24
24
36
all
book.book Page 100 Monday, June 15, 2009 11:33 AM

Dell PowerEdge T710 Specifications

General

Tcase	76 °C
Bus type	QPI
Stepping	D0
FSB Parity	No
Processor code	SLBF8
Processor cache	4 MB
Processor cores	4
Processor model	E5506
System bus rate	4.8 GT/s
Processor series	Intel Xeon 5500 Series
Processor socket	Socket B (LGA 1366)
Processor codename	Nehalem EP
Motherboard chipset	Intel® 5520
Number of QPI links	2
Processor frequency	2.13 GHz
Processor cache type	Smart Cache
Processor lithography	45 nm
Processor system type	DP
Processor manufacturer	Intel
Processor package size	42.5 x 45 mm
Processor front side bus	- MHz
Processor operating modes	64-bit
ECC supported by processor	Yes
Thermal Design Power (TDP)	80 W
Compatible processor series	Intel® Xeon®
Number of processors installed	1
CPU multiplier (bus/core ratio)	16
Memory types supported by processor	DDR3-SDRAM
Memory channels supported by processor	Triple
Memory clock speeds supported by processor	800 MHz
Memory bandwidth supported by processor (max)	19.2 GB/s
Maximum internal memory supported by processor	144 GB
HDD size	3.5 \
HDD speed	15000 RPM
HDD interface	Serial Attached SCSI (SAS)
Optical drive type	DVD-ROM
Total storage capacity	300 GB
Maximum storage capacity	- TB
Number of HDDs supported	6
Graphics card	G200
Graphics card family	Matrox
Memory slots	18x DIMM
Internal memory	4 GB
Memory clock speed	1333 MHz
Maximum internal memory	192 GB
Memory layout (slots x size)	2 x 2 GB
Networking features	Gigabit Ethernet
PS/2 ports quantity	0
USB 2.0 ports quantity	8
PCI Express x8 slots	5
Power supply	1100 W
Number of power supply units	-
Compatible operating systems	Windows Small Business Server 2011 Windows Small Business Server 2008 Windows Server 2008 SP2, x86/x64 (x64 includes Hyper-V) Windows Server 2008 R2 SP1, x64 (includes Hyper-V v2) Windows HPC Server 2008 Novell SUSE Linux Enterprise Server Red Hat Enterprise Linux
Sustainability certificates	ENERGY STAR
Compliance industry standards	IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Chassis type	Tower (5U)
Processor ARK ID	37096

Weight and Dimensions

Depth	731.8 mm
Width	217.9 mm
Height	466.3 mm
Weight	35300 g