Dell PowerEdge T710 User Manual

152 Installing System Components
System Board (Service-Only Procedure)
WARNING: The heat sink can get hot during operation. To avoid burns, ensure
that the system has sufficient time to cool before removing the system board.
CAUTION: If you are using the Trusted Platform Module (TPM) with an encryption
program, you may be prompted to create a recovery key during system or program
setup. Be sure to create and safely store this recovery key. If you ever need to
replace the system board, you must supply the recovery key when you restart your
system or program before you can access the encrypted data on your hard drive(s).
Removing the System Board
WARNING: Only trained service technicians are authorized to remove the system
cover and access any of the components inside the system. Before you begin this
procedure, review the safety instructions that came with the system.
1 Turn off the system, including any attached peripherals, and disconnect
the system from the electrical outlet and peripherals.
2 Remove the front bezel. See "Removing the Front Bezel" on page 84.
3 Rotate the system feet inward and lay the system on a flat surface.
4 Open the system. See "Opening the System" on page 85.
5 Remove the cooling shroud. See "Removing the Cooling Shroud" on
page 87.
6 Disconnect all the cables from the system board.
7 If applicable, remove all expansion cards and any attached cables. See
"Removing an Expansion Card" on page 118.
8 Remove all the memory modules. See "Removing Memory Modules" on
page 106.
NOTE: To ensure proper reinstallation of memory modules, record the
memory module socket locations.
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Dell PowerEdge T710 Specifications

General

Tcase	76 °C
Bus type	QPI
Stepping	D0
FSB Parity	No
Processor code	SLBF8
Processor cache	4 MB
Processor cores	4
Processor model	E5506
System bus rate	4.8 GT/s
Processor series	Intel Xeon 5500 Series
Processor socket	Socket B (LGA 1366)
Processor codename	Nehalem EP
Motherboard chipset	Intel® 5520
Number of QPI links	2
Processor frequency	2.13 GHz
Processor cache type	Smart Cache
Processor lithography	45 nm
Processor system type	DP
Processor manufacturer	Intel
Processor package size	42.5 x 45 mm
Processor front side bus	- MHz
Processor operating modes	64-bit
ECC supported by processor	Yes
Thermal Design Power (TDP)	80 W
Compatible processor series	Intel® Xeon®
Number of processors installed	1
CPU multiplier (bus/core ratio)	16
Memory types supported by processor	DDR3-SDRAM
Memory channels supported by processor	Triple
Memory clock speeds supported by processor	800 MHz
Memory bandwidth supported by processor (max)	19.2 GB/s
Maximum internal memory supported by processor	144 GB
HDD size	3.5 \
HDD speed	15000 RPM
HDD interface	Serial Attached SCSI (SAS)
Optical drive type	DVD-ROM
Total storage capacity	300 GB
Maximum storage capacity	- TB
Number of HDDs supported	6
Graphics card	G200
Graphics card family	Matrox
Memory slots	18x DIMM
Internal memory	4 GB
Memory clock speed	1333 MHz
Maximum internal memory	192 GB
Memory layout (slots x size)	2 x 2 GB
Networking features	Gigabit Ethernet
PS/2 ports quantity	0
USB 2.0 ports quantity	8
PCI Express x8 slots	5
Power supply	1100 W
Number of power supply units	-
Compatible operating systems	Windows Small Business Server 2011 Windows Small Business Server 2008 Windows Server 2008 SP2, x86/x64 (x64 includes Hyper-V) Windows Server 2008 R2 SP1, x64 (includes Hyper-V v2) Windows HPC Server 2008 Novell SUSE Linux Enterprise Server Red Hat Enterprise Linux
Sustainability certificates	ENERGY STAR
Compliance industry standards	IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Chassis type	Tower (5U)
Processor ARK ID	37096

Weight and Dimensions

Depth	731.8 mm
Width	217.9 mm
Height	466.3 mm
Weight	35300 g