EasyManuals Logo

Dell PowerEdge T710 User Manual

Dell PowerEdge T710
214 pages
To Next Page IconTo Next Page
To Next Page IconTo Next Page
To Previous Page IconTo Previous Page
To Previous Page IconTo Previous Page
Page #153 background imageLoading...
Page #153 background image
Installing System Components 153
9
Remove the cooling fans. See "Removing a Cooling-Fan Module" on
page 136.
10
Remove the fan cage. See "Removing the Fan Cage" on page 138.
11
If applicable, remove the iDRAC6 Enterprise card. See "Removing an
iDRAC6 Enterprise Card" on page 142.
WARNING: The heat sink can get hot during operation. To avoid burns, ensure
that the system has sufficient time to cool before removing the system board.
12
Remove any installed heat sinks, processors and heat-sink blanks. See
"Removing a Processor" on page 107.
13
If applicable, remove the SAS backplane from system. See "Removing the
SAS Backplane" on page 149.
14
Carefully route any loose cables away from the edges of the system board.
15
Remove the system board from the chassis:
a
Pull and hold the blue system board release pin. See Figure 3-30.
b
While holding the release pin, slide the system board towards the
front of the system. See Figure 3-30.
WARNING: Do not lift the system board by the memory modules latches or any
component on the system board.
c
Lift the system board until the securing slots on the system board are
free from the tabs on the chassis.
book.book Page 153 Monday, June 15, 2009 11:33 AM

Table of Contents

Other manuals for Dell PowerEdge T710

Questions and Answers:

Question and Answer IconNeed help?

Do you have a question about the Dell PowerEdge T710 and is the answer not in the manual?

Dell PowerEdge T710 Specifications

General IconGeneral
Tcase76 °C
Bus typeQPI
SteppingD0
FSB ParityNo
Processor codeSLBF8
Processor cache4 MB
Processor cores4
Processor modelE5506
System bus rate4.8 GT/s
Processor seriesIntel Xeon 5500 Series
Processor socketSocket B (LGA 1366)
Processor codenameNehalem EP
Motherboard chipsetIntel® 5520
Number of QPI links2
Processor frequency2.13 GHz
Processor cache typeSmart Cache
Processor lithography45 nm
Processor system typeDP
Processor manufacturerIntel
Processor package size42.5 x 45 mm
Processor front side bus- MHz
Processor operating modes64-bit
ECC supported by processorYes
Thermal Design Power (TDP)80 W
Compatible processor seriesIntel® Xeon®
Number of processors installed1
CPU multiplier (bus/core ratio)16
Memory types supported by processorDDR3-SDRAM
Memory channels supported by processorTriple
Memory clock speeds supported by processor800 MHz
Memory bandwidth supported by processor (max)19.2 GB/s
Maximum internal memory supported by processor144 GB
HDD size3.5 \
HDD speed15000 RPM
HDD interfaceSerial Attached SCSI (SAS)
Optical drive typeDVD-ROM
Total storage capacity300 GB
Maximum storage capacity- TB
Number of HDDs supported6
Graphics cardG200
Graphics card familyMatrox
Memory slots18x DIMM
Internal memory4 GB
Memory clock speed1333 MHz
Maximum internal memory192 GB
Memory layout (slots x size)2 x 2 GB
Networking featuresGigabit Ethernet
PS/2 ports quantity0
USB 2.0 ports quantity8
PCI Express x8 slots5
Power supply1100 W
Number of power supply units-
Compatible operating systemsWindows Small Business Server 2011 Windows Small Business Server 2008 Windows Server 2008 SP2, x86/x64 (x64 includes Hyper-V) Windows Server 2008 R2 SP1, x64 (includes Hyper-V v2) Windows HPC Server 2008 Novell SUSE Linux Enterprise Server Red Hat Enterprise Linux
Sustainability certificatesENERGY STAR
Compliance industry standardsIEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Chassis typeTower (5U)
Processor ARK ID37096
Weight and Dimensions IconWeight and Dimensions
Depth731.8 mm
Width217.9 mm
Height466.3 mm
Weight35300 g

Related product manuals