Fujitsu PRIMERGY RX1330 M3 Upgrade And Maintenance Manual

RX1330 M3 Upgrade and Maintenance Manual 233
Processor (CPU)
Ê "Getting access to the component" on page 55
Ê "Removing a riser module" on page 66
11.2.2 Removing the heat sink
Figure 145: Removing the heat sink
Ê Loosen the four screws of the heat sink in a crossover pattern according to
the numbering.
Ê Carefully turn the heat sink back and forth to detach it from the CPU.
I This may be necessary due to the adhesive quality of the thermal
paste located between the heat sink and the CPU.
V CAUTION!
Pay special attention not to damage any system board components
surrounding the CPU socket.
Ê Lift the heat sink out of the chassis.
Ê Remove the residual thermal paste from the underside of the heat sink and
the surface of the CPU.
Ê Clean the underside of the heat sink and the surface of the CPU using a lint-
free cloth.

Fujitsu PRIMERGY RX1330 M3 Specifications

General

Processor ARK ID	97479
CPU configuration (max)	1
Intel Secure Key Technology version	1.00
Intel® Quick Sync Video Technology	No
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
HDD size	2.5/3.5 \
HDD interface	Serial ATA, Serial Attached SCSI (SAS)
Optical drive type	-
Supported HDD sizes	2.5, 3.5 \
Total storage capacity	0 GB
Maximum storage capacity	- TB
Number of HDDs installed	0
Supported storage drive interfaces	SAS, Serial ATA
Bus type	DMI3
Stepping	B0
Scalability	1S
Processor code	SR326
Processor cache	8 MB
Processor cores	4
Processor model	E3-1270V6
System bus rate	8 GT/s
Processor socket	LGA 1151 (Socket H4)
Processor threads	8
Processor codename	Kaby Lake
Motherboard chipset	Intel® C236
Processor frequency	3.8 GHz
Processor cache type	Smart Cache
Processor lithography	14 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor boost frequency	4.2 GHz
Processor operating modes	64-bit
PCI Express configurations	1x16, 1x8+2x4, 2x8
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Thermal Design Power (TDP)	72 W
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3-SDRAM, DDR4-SDRAM
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	1866, 2400 MHz
Memory bandwidth supported by processor (max)	37.5 GB/s
Maximum internal memory supported by processor	64 GB
Compatible operating systems	Microsoft Hyper-V Server 2012 R2 Microsoft Hyper-V Server 2016 Microsoft Windows Server 2012 R2 Datacenter Microsoft Windows Server 2016 Datacenter Microsoft Windows Server 2012 R2 Standard Microsoft Windows Server 2016 Standard Microsoft Windows Server 2012 R2 Essentials Microsoft Windows Server 2016 Essentials Microsoft Windows Server 2012 R2 Foundation Microsoft Windows Storage Server 2012 R2 Standard Microsoft Windows Storage Server 2016 Standard Microsoft Hyper-V Server 2012 Microsoft Windows Server 2012 Datacenter Microsoft Windows Server 2012 Standard Microsoft Windows Server 2012 Essentials Microsoft Windows Server 2012 Foundation Microsoft Windows Storage Server 2012 Standard VMware vSphere 6.0 SUSE Linux Enterprise Server 12 Red Hat Enterprise Linux 7
Internal memory	32 GB
Memory clock speed	2400 MHz
Internal memory type	DDR4-SDRAM
Memory layout (slots x size)	2 x 16 GB
On-board graphics card model	Not available
Power supply	450 W
Number of redundant power supplies supported	2
LAN controller	Intel i210
Cabling technology	10/100/1000Base-T(X)
Ethernet interface type	Gigabit Ethernet
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	6
Operating temperature (T-T)	5 - 40 °C
Operating relative humidity (H-H)	10 - 85 %
Certification	CE, RoHS, WEEE, GS, CE, CSAc/us, ULc/us, FCC Class A, VCCI:V3 Class A + JIS 61000-3-2, GOST, KC, CCC, C-TIck, BSMI
PCI Express slots version	3.0
Chassis type	Rack (1U)

Weight and Dimensions

Depth	572 mm
Width	435.4 mm
Height	42.8 mm
Weight	13000 g