Fujitsu PRIMERGY RX1330 M3 Upgrade And Maintenance Manual

RX1330 M3 Upgrade and Maintenance Manual 273
14 System board and components
Safety notes
V CAUTION!
● Devices and components inside the server remain hot after
shutdown. After shutting down the server, wait for hot components to
cool down before installing or removing internal options.
● Circuit boards and soldered parts of internal options are exposed and
can be damaged by static electricity. Always discharge static build-up
(e.g. by touching a grounded object) before handling electrostatic-
sensitive devices (ESDs).
● Do not touch the circuitry on boards or soldered parts. Hold circuit
boards by their metallic areas or edges.
● For further information, please refer to chapter "Important
information" on page 35.
14.1 Basic information
This section provides instructions for the system board and the following
components:
● CMOS memory (volatile BIOS memory) and the real-time clock are powered
by a lithium coin cell (CMOS battery). This cell lasts up to ten years,
depending on ambient temperature and use.
If the CMOS battery is depleted or falls below minimum voltage levels, it
need to be replaced immediately.
● UFM (USB Flash Module)
The server can be equipped with a UFM.
● TPM (Trusted Platform Module)
The system board is optionally equipped with a TPM. This module enables
programs from third party manufacturers to store key information, for
example drive encryption using Windows Bitlocker Drive Encryption.

Fujitsu PRIMERGY RX1330 M3 Specifications

General

Processor ARK ID	97479
CPU configuration (max)	1
Intel Secure Key Technology version	1.00
Intel® Quick Sync Video Technology	No
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
HDD size	2.5/3.5 \
HDD interface	Serial ATA, Serial Attached SCSI (SAS)
Optical drive type	-
Supported HDD sizes	2.5, 3.5 \
Total storage capacity	0 GB
Maximum storage capacity	- TB
Number of HDDs installed	0
Supported storage drive interfaces	SAS, Serial ATA
Bus type	DMI3
Stepping	B0
Scalability	1S
Processor code	SR326
Processor cache	8 MB
Processor cores	4
Processor model	E3-1270V6
System bus rate	8 GT/s
Processor socket	LGA 1151 (Socket H4)
Processor threads	8
Processor codename	Kaby Lake
Motherboard chipset	Intel® C236
Processor frequency	3.8 GHz
Processor cache type	Smart Cache
Processor lithography	14 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor boost frequency	4.2 GHz
Processor operating modes	64-bit
PCI Express configurations	1x16, 1x8+2x4, 2x8
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Thermal Design Power (TDP)	72 W
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3-SDRAM, DDR4-SDRAM
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	1866, 2400 MHz
Memory bandwidth supported by processor (max)	37.5 GB/s
Maximum internal memory supported by processor	64 GB
Compatible operating systems	Microsoft Hyper-V Server 2012 R2 Microsoft Hyper-V Server 2016 Microsoft Windows Server 2012 R2 Datacenter Microsoft Windows Server 2016 Datacenter Microsoft Windows Server 2012 R2 Standard Microsoft Windows Server 2016 Standard Microsoft Windows Server 2012 R2 Essentials Microsoft Windows Server 2016 Essentials Microsoft Windows Server 2012 R2 Foundation Microsoft Windows Storage Server 2012 R2 Standard Microsoft Windows Storage Server 2016 Standard Microsoft Hyper-V Server 2012 Microsoft Windows Server 2012 Datacenter Microsoft Windows Server 2012 Standard Microsoft Windows Server 2012 Essentials Microsoft Windows Server 2012 Foundation Microsoft Windows Storage Server 2012 Standard VMware vSphere 6.0 SUSE Linux Enterprise Server 12 Red Hat Enterprise Linux 7
Internal memory	32 GB
Memory clock speed	2400 MHz
Internal memory type	DDR4-SDRAM
Memory layout (slots x size)	2 x 16 GB
On-board graphics card model	Not available
Power supply	450 W
Number of redundant power supplies supported	2
LAN controller	Intel i210
Cabling technology	10/100/1000Base-T(X)
Ethernet interface type	Gigabit Ethernet
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	6
Operating temperature (T-T)	5 - 40 °C
Operating relative humidity (H-H)	10 - 85 %
Certification	CE, RoHS, WEEE, GS, CE, CSAc/us, ULc/us, FCC Class A, VCCI:V3 Class A + JIS 61000-3-2, GOST, KC, CCC, C-TIck, BSMI
PCI Express slots version	3.0
Chassis type	Rack (1U)

Weight and Dimensions

Depth	572 mm
Width	435.4 mm
Height	42.8 mm
Weight	13000 g