Technical Reference Guide www.hp.com 3-3
Processor/Memory Subsystem
3.2.2 Processor Changing/Upgrading
All models use the LGA775 ZIF (Socket T) mounting socket. These systems require that the
processor use an integrated heatsink/fan assembly. A replacement processor must use the same
type heatsink/fan assembly as the original to ensure proper cooling. The heatsink and attachment
clip are specially designed provide maximum heat transfer from the processor component.
CAUTION: Attachment of the heatsink to the processor is critical on these systems. Improper attachment
of the heatsink will likely result in a thermal condition. Although the system is designed to detect thermal
conditions and automatically shut down, such a condition could still result in damage to the processor
component. Refer to the applicable Service Reference Guide for processor installation instructions.
These sysems are available with one of the following processors listed in Table 3-1.
NOTE:
[1] Standard Intel feature set including EM64T, XD, and EIST support. Refer to www.Intel.com for
detailed information.
CAUTION: The USDT form factor can support a processor with a maximum power consumption of 65
watts. The SFF and CMT form factors can support a processor with a maximum power consumption of 95
watts. Exceeding these limits can result in system damage and lost data.
Table 3-1
Supported Processors
Intel
Model
Core
design Features
Clock
Speed
in GHz
FSB
Speed
in MHz
L2
Cache
Form
Factor
support
Q6700 quad VT, [1] 2.66 1066 8 MB SFF, CMT
Q6600 quad VT, [1] 2.40 1066 8 MB SFF, CMT
E6850 dual vPro, VT, TXT, [1] 3.00 1333 4 MB all
E6750 dual vPro, VT, TXT, [1] 2.66 1333 4 MB all
E6550 dual vPro, VT, TXT, [1] 2.33 1333 4 MB all
E4500 dual [1] 2.20 800 2 MB all
E4400 dual [1] 2.00 800 2 MB all
E2180 dual [1] 2.00 800 1 MB all
E2160 dual [1] 1.80 800 1 MB all
440 single [1] 2.00 800 512 KB all
To Next Page
Loading...
Need help?
General