HP Elite Slice G2 Service Manual

HP Optical Disc Drive (ODD) Module (optional)
The ODD Module (available as an after-market option) may be ordered to add optical drive functionality.
Additional optical drive modules may be connected to an Elite Slice G2 conguration, depending upon the
power supply and the total number of powered modules.
Item Component Item Component
1 Optical drive disc tray 3 Optical drive eject button
2 Optical drive light 4 Manual eject hole
HP Slice VESA plate (optional)
The optional Slice VESA plate enables the Elite Slice G2 assembly to be mounted onto a table. The Elite Slide
G2 should not be mounted to a wall or under a desk.
Item Component Item Component
1 Quick release latch 2 Security cable slot
Connecting or removing modules
Additional modules may be connected to the Elite Slice G2. Modules should be attached to the Base Module in
the following order, from top to bottom:
●
Video Ingest Module (required for the Microsoft SRS only)
●
Wireless Display Module (optional)
●
ODD Module (optional)
●
VESA plate (optional)
HP Optical Disc Drive (ODD) Module (optional) 5

HP Elite Slice G2 Specifications

General

Bus type	DMI3
Processor cache	6 MB
Processor model	i5-7500T
Processor threads	4
Processor frequency	2.7 GHz
Processor cache type	L3
Processor manufacturer	Intel
Processor boost frequency	3.3 GHz
Number of processors installed	1
Configurable TDP-down frequency	1.7 GHz
ECC	No
Internal memory	8 GB
Memory clock speed	2400 MHz
Internal memory type	DDR4-SDRAM
Maximum internal memory	- GB
Memory layout (slots x size)	2 x 4 GB
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
SSD interface	NVMe
Storage media	SSD
SSD form factor	M.2
Total storage capacity	128 GB
Intel Identity Protection Technology version	1.00
Sustainability certificates	ENERGY STAR
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 630
Maximum on-board graphics card memory	64 GB
Antenna type	2x2
Bluetooth version	4.2
Top Wi-Fi standard	Wi-Fi 5 (802.11ac)
WLAN controller model	Intel Dual Band Wireless-AC 8260
Ethernet LAN data rates	10, 100, 1000 Mbit/s
USB 2.0 ports quantity	0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	2
Chassis type	USFF
Product color	Black
Country of origin	China
Audio chip	Conexant CX7501
Product type	PC
Motherboard chipset	Intel® Q170
Operating system installed	Windows 10 IoT Enterprise
HP segment	Business
Power supply	90 W

Weight and Dimensions

Width	165 mm
Height	112 mm
Weight	1520 g
Package depth	596 mm
Package width	203 mm
Package height	273 mm
Package weight	6670 g