HP Elite Slice G2 Service Manual

Installing system memory modules
IMPORTANT: You must disconnect the AC power cord and wait approximately 30 seconds for the power to
drain before adding or removing memory modules. Regardless of the power-on state, voltage is always
supplied to the memory modules as long as the computer is plugged into an active AC outlet. Adding or
removing memory modules while voltage is present may cause irreparable damage to the memory modules
or system board.
The memory module slots have gold-plated metal contacts. When upgrading the memory, it is important to
use memory modules with gold-Plated metal contacts to prevent corrosion and/or oxidation resulting from
having incompatible metals in contact with each other.
Static electricity can damage the electronic components of the computer or optional cards. Before beginning
these procedures, ensure that you are discharged of static electricity by
briey touching a grounded metal
object. For more information, see Electrostatic discharge information on page 15.
When handling a memory module, be careful not to touch any of the contacts. Doing so may damage the
module.
1. Remove the access panel (see Access panel on page 21).
2. To remove a memory module, press outward on the two latches on each side of the memory module (1),
and then pull the memory module out of the slot (2).
24 Chapter 4 Removal and replacement procedures – HP Elite Slice Base Module

HP Elite Slice G2 Specifications

General

Bus type	DMI3
Processor cache	6 MB
Processor model	i5-7500T
Processor threads	4
Processor frequency	2.7 GHz
Processor cache type	L3
Processor manufacturer	Intel
Processor boost frequency	3.3 GHz
Number of processors installed	1
Configurable TDP-down frequency	1.7 GHz
ECC	No
Internal memory	8 GB
Memory clock speed	2400 MHz
Internal memory type	DDR4-SDRAM
Maximum internal memory	- GB
Memory layout (slots x size)	2 x 4 GB
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
SSD interface	NVMe
Storage media	SSD
SSD form factor	M.2
Total storage capacity	128 GB
Intel Identity Protection Technology version	1.00
Sustainability certificates	ENERGY STAR
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 630
Maximum on-board graphics card memory	64 GB
Antenna type	2x2
Bluetooth version	4.2
Top Wi-Fi standard	Wi-Fi 5 (802.11ac)
WLAN controller model	Intel Dual Band Wireless-AC 8260
Ethernet LAN data rates	10, 100, 1000 Mbit/s
USB 2.0 ports quantity	0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	2
Chassis type	USFF
Product color	Black
Country of origin	China
Audio chip	Conexant CX7501
Product type	PC
Motherboard chipset	Intel® Q170
Operating system installed	Windows 10 IoT Enterprise
HP segment	Business
Power supply	90 W

Weight and Dimensions

Width	165 mm
Height	112 mm
Weight	1520 g
Package depth	596 mm
Package width	203 mm
Package height	273 mm
Package weight	6670 g