HP Elite Slice G2 Service Manual

2. Press the modules down onto the VESA plate.
3. Slide the quick release latch on the back of the VESA plate to the locked position to lock all modules
together.
CAUTION: There are four tabs in the VESA plate. When you position the Elite Slice G2 conguration
correctly onto the VESA plate and slide the quick release latch to the locked position, the four tabs lock
the VESA plate to the Elite Slice G2 assembly. If the VESA plate is not correctly oriented, the quick release
latch cannot be moved to the locked position and the modules are not secured.
4. Install a security cable in the VESA plate security cable slot to prevent the quick release latch from being
unlocked and the modules from being separated.
NOTE: The security cable is designed to act as a deterrent, but it may not prevent the computer from
being mishandled or stolen.
Connecting or removing modules 7

HP Elite Slice G2 Specifications

General

Bus type	DMI3
Processor cache	6 MB
Processor model	i5-7500T
Processor threads	4
Processor frequency	2.7 GHz
Processor cache type	L3
Processor manufacturer	Intel
Processor boost frequency	3.3 GHz
Number of processors installed	1
Configurable TDP-down frequency	1.7 GHz
ECC	No
Internal memory	8 GB
Memory clock speed	2400 MHz
Internal memory type	DDR4-SDRAM
Maximum internal memory	- GB
Memory layout (slots x size)	2 x 4 GB
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
SSD interface	NVMe
Storage media	SSD
SSD form factor	M.2
Total storage capacity	128 GB
Intel Identity Protection Technology version	1.00
Sustainability certificates	ENERGY STAR
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 630
Maximum on-board graphics card memory	64 GB
Antenna type	2x2
Bluetooth version	4.2
Top Wi-Fi standard	Wi-Fi 5 (802.11ac)
WLAN controller model	Intel Dual Band Wireless-AC 8260
Ethernet LAN data rates	10, 100, 1000 Mbit/s
USB 2.0 ports quantity	0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	2
Chassis type	USFF
Product color	Black
Country of origin	China
Audio chip	Conexant CX7501
Product type	PC
Motherboard chipset	Intel® Q170
Operating system installed	Windows 10 IoT Enterprise
HP segment	Business
Power supply	90 W

Weight and Dimensions

Width	165 mm
Height	112 mm
Weight	1520 g
Package depth	596 mm
Package width	203 mm
Package height	273 mm
Package weight	6670 g