HP EliteBook 2540P User Manual

Bottom components
Item Component Description
(1) Battery release latches (2) Release the battery from the battery bay.
(2) Battery bay Holds the battery.
(3) Vents (7) Enable airflow to cool internal components.
NOTE: The computer fan starts up automatically to
cool internal components and prevent overheating. It
is normal for the internal fan to cycle on and off during
routine operation.
(4) SIM slot (select models only) Contains a wireless SIM. The SIM slot is located
inside the battery bay.
(5) Hard drive bay and memory module compartment Holds a 1.8-in hard drive and contains an expansion
memory module slot.
NOTE: If the computer is equipped with a 1.8-in
hard drive or solid-state drive, it is installed in this
location. If the computer is equipped with a 2.5-in
hard drive or solid-state drive, it is installed in the
optical drive bay (see item 8).
(6) Speakers (2) Produce sound.
ENWW Bottom components 19

HP EliteBook 2540P Specifications

General

Bus type	DMI
Stepping	C2
Tjunction	105 °C
Processor cache	4 MB
Processor cores	2
Processor model	i7-640LM
System bus rate	2.5 GT/s
Processor family	Intel® Core™ i7
Processor series	Intel Core i7-600 Mobile Series
Processor socket	BGA 1288
Processor threads	4
Processor codename	Arrandale
Processing Die size	81 mm²
Processor frequency	2.13 GHz
Processor cache type	Smart Cache
Processor lithography	32 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor boost frequency	2.93 GHz
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x16
Thermal Design Power (TDP)	25 W
Maximum number of PCI Express lanes	16
Number of Processing Die Transistors	382 M
Motherboard chipset	Intel® QM57 Express
HDD speed	5400 RPM
HDD interface	SATA
Optical drive type	DVD Super Multi DL
Card reader integrated	Yes
Total storage capacity	250 GB
Display diagonal	12.1 \
Display resolution	1280 x 800 pixels
Native aspect ratio	16:10
Memory slots	2x SO-DIMM
Internal memory	2 GB
Internal memory type	DDR3-SDRAM
Maximum internal memory	- GB
Memory layout (slots x size)	1 x 2 GB
Discrete graphics card model	-
On-board graphics card model	Intel® HD Graphics
On-board graphics card base frequency	266 MHz
On-board graphics card dynamic frequency (max)	566 MHz
Type	PC
Intel segment tagging	Enterprise
Bluetooth version	2.1+EDR
Operating system installed	Windows XP Professional
Number of battery cells	6
Charging port type	DC-in jack
Serial ports quantity	0
USB 2.0 ports quantity	3
Cable lock slot type	Kensington
Product color	Black
Country of origin	China
Pointing device	Touchpad
Processor code	SLBMK
Processor ARK ID	43563
Processor package size	BGA 34 x 28 mm
Graphics & IMC lithography	45 nm
Supported instruction sets	SSE4.1, SSE4.2
Intel® Turbo Boost Technology	1.0

Weight and Dimensions

Depth	210 mm
Width	280 mm
Weight	1530 g
Height (front)	30 mm