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HP EliteBook 2540P User Manual

HP EliteBook 2540P
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Packaging and transporting guidelines
Follow these grounding guidelines when packaging and transporting equipment:
To avoid hand contact, transport products in static-safe tubes, bags, or boxes.
Protect ESD-sensitive parts and assemblies with conductive or approved containers or
packaging.
Keep ESD-sensitive parts in their containers until the parts arrive at static-free workstations.
Place items on a grounded surface before removing items from their containers.
Always be properly grounded when touching a component or assembly.
Store reusable ESD-sensitive parts from assemblies in protective packaging or nonconductive
foam.
Use transporters and conveyors made of antistatic belts and roller bushings. Be sure that
mechanized equipment used for moving materials is wired to ground and that proper materials
are selected to avoid static charging. When grounding is not possible, use an ionizer to dissipate
electric charges.
Workstation guidelines
Follow these grounding workstation guidelines:
Cover the workstation with approved static-shielding material.
Use a wrist strap connected to a properly grounded work surface and use properly grounded
tools and equipment.
Use conductive field service tools, such as cutters, screwdrivers, and vacuums.
When fixtures must directly contact dissipative surfaces, use fixtures made only of static-safe
materials.
Keep the work area free of nonconductive materials, such as ordinary plastic assembly aids and
Styrofoam.
Handle ESD-sensitive components, parts, and assemblies by the case or PCM laminate. Handle
these items only at static-free workstations.
Avoid contact with pins, leads, or circuitry.
Turn off power and input signals before inserting or removing connectors or test equipment.
44 Chapter 4 Removal and replacement procedures ENWW

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HP EliteBook 2540P Specifications

General IconGeneral
Bus typeDMI
SteppingC2
Tjunction105 °C
Processor cache4 MB
Processor cores2
Processor modeli7-640LM
System bus rate2.5 GT/s
Processor familyIntel® Core™ i7
Processor seriesIntel Core i7-600 Mobile Series
Processor socketBGA 1288
Processor threads4
Processor codenameArrandale
Processing Die size81 mm²
Processor frequency2.13 GHz
Processor cache typeSmart Cache
Processor lithography32 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version2.0
Processor boost frequency2.93 GHz
Processor operating modes64-bit
ECC supported by processorNo
PCI Express configurations1x16
Thermal Design Power (TDP)25 W
Maximum number of PCI Express lanes16
Number of Processing Die Transistors382 M
Motherboard chipsetIntel® QM57 Express
HDD speed5400 RPM
HDD interfaceSATA
Optical drive typeDVD Super Multi DL
Card reader integratedYes
Total storage capacity250 GB
Display diagonal12.1 \
Display resolution1280 x 800 pixels
Native aspect ratio16:10
Memory slots2x SO-DIMM
Internal memory2 GB
Internal memory typeDDR3-SDRAM
Maximum internal memory- GB
Memory layout (slots x size)1 x 2 GB
Discrete graphics card model-
On-board graphics card modelIntel® HD Graphics
On-board graphics card base frequency266 MHz
On-board graphics card dynamic frequency (max)566 MHz
TypePC
Intel segment taggingEnterprise
Bluetooth version2.1+EDR
Operating system installedWindows XP Professional
Number of battery cells6
Charging port typeDC-in jack
Serial ports quantity0
USB 2.0 ports quantity3
Cable lock slot typeKensington
Product colorBlack
Country of originChina
Pointing deviceTouchpad
Processor codeSLBMK
Processor ARK ID43563
Processor package sizeBGA 34 x 28 mm
Graphics & IMC lithography45 nm
Supported instruction setsSSE4.1, SSE4.2
Intel® Turbo Boost Technology1.0
Weight and Dimensions IconWeight and Dimensions
Depth210 mm
Width280 mm
Weight1530 g
Height (front)30 mm

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