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HP EliteOne 800 G3 User Manual

HP EliteOne 800 G3
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Country-specic requirements
Additional requirements specic to a country are shown in parentheses and explained below.
Country Accrediting Agency Country Accrediting Agency
Australia (1)
Austria (1)
Belgium (1)
Canada (2)
EANSW
OVE
CEBC
CSA
Italy (1)
Japan (3)
Norway (1)
Sweden (1)
IMQ
METI
NEMKO
SEMKO
Denmark (1)
Finland (1)
France (1)
Germany (1)
DEMKO
SETI
UTE
VDE
Switzerland (1)
United Kingdom (1)
United States (2)
SEV
BSI
UL
1. The exible cord must be Type HO5VV-F, 3-conductor, 0.75mm
2
conductor size. Power cord set ttings (appliance coupler and
wall plug) must bear the certication mark of the agency responsible for evaluation in the country where it will be used.
2. The exible cord must be Type SVT or equivalent, No. 18 AWG, 3-conductor. The wall plug must be a two-pole grounding type
with a NEMA 5-15P (15A, 125V) or NEMA 6-15P (15A, 250V) conguration.
3. Appliance coupler, exible cord, and wall plug must bear a “T” mark and registration number in accordance with the Japanese
Dentori Law. Flexible cord must be Type VCT or VCTF, 3-conductor, 0.75 mm
2
conductor size. Wall plug must be a two-pole
grounding type with a Japanese Industrial Standard C8303 (7A, 125V) conguration.
Country-specic requirements 123

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HP EliteOne 800 G3 Specifications

General IconGeneral
Tcase71 °C
Bus typeDMI3
SteppingR0
Processor codeSR2BX
Processor cache6 MB
Processor cores4
Processor modeli5-6500
System bus rate8 GT/s
Processor familyIntel® Core™ i5
Processor seriesIntel Core i5-6500 Desktop series
Processor socketLGA 1151 (Socket H4)
Processor codenameSkylake
Processor frequency3.2 GHz
Processor cache typeSmart Cache
Processor lithography14 nm
Processor manufacturerIntel
Conflict-Free processorYes
Processor front side bus- MHz
PCI Express slots version3.0
Processor boost frequency3.6 GHz
Processor operating modes64-bit
PCI Express configurations1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)65 W
Maximum number of PCI Express lanes16
Memory types supported by processorDDR3L-SDRAM, DDR4-SDRAM
Memory voltage supported by processor1.35 V
Memory clock speeds supported by processor2133, 1333, 1600, 1866 MHz
Memory bandwidth supported by processor (max)34.1 GB/s
Maximum internal memory supported by processor64 GB
Discrete graphics cardNo
On-board graphics card ID1912
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics 530
Maximum on-board graphics card memory1.74 GB
On-board graphics card OpenGL version4.4
On-board graphics card base frequency350 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)1050 MHz
Number of displays supported (on-board graphics)3
Color gamut72 %
RGB color spaceNTSC
Display diagonal23.8 \
Native aspect ratio16:9
Product typeAll-in-One PC
Motherboard chipsetIntel® Q270
Memory slots2
Internal memory8 GB
Memory slots typeSO-DIMM
Memory clock speed2400 MHz
Internal memory typeDDR4-SDRAM
Maximum internal memory32 GB
Memory layout (slots x size)1 x 8 GB
SSD capacity256 GB
SSD interfacePCI Express
Storage mediaSSD
Optical drive typeDVD-RW
Card reader integrated-
Number of storage drives installed1
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity6
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity0
Product colorBlack, Silver
Country of originChina
Antenna type2x2
Wi-Fi standardsWi-Fi 5 (802.11ac)
Ethernet LAN data rates10, 100, 1000 Mbit/s
AC adapter power180 W
Recovery operating systemWindows 10 Pro
Operating system installedWindows 7 Professional
Scalability1S
Processor ARK ID88184
Processor package size37.5 x 37.5 mm
Supported instruction setsSSE4.2, AVX 2.0, SSE4.1
Thermal solution specificationPCG 2015C
Intel Identity Protection Technology version1.00
Weight and Dimensions IconWeight and Dimensions
Depth (with stand)53.8 mm
Width (with stand)539.6 mm
Height (with stand)314.8 mm
Weight (with stand)6030 g

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