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HP X2 210 G2 User Manual

HP X2 210 G2
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Packaging and transporting guidelines
Follow these grounding guidelines when packaging and transporting equipment:
To avoid hand contact, transport products in static-safe tubes, bags, or boxes.
Protect ESD-sensitive parts and assemblies with conductive or approved containers or packaging.
Keep ESD-sensitive parts in their containers until the parts arrive at static-free workstations.
Place items on a grounded surface before removing items from their containers.
Always be properly grounded when touching a component or assembly.
Store reusable ESD-sensitive parts from assemblies in protective packaging or nonconductive foam.
Use transporters and conveyors made of antistatic belts and roller bushings. Be sure that mechanized
equipment used for moving materials is wired to ground and that proper materials are selected to avoid
static charging. When grounding is not possible, use an ionizer to dissipate electric charges.
Workstation guidelines
Follow these grounding workstation guidelines:
Cover the workstation with approved static-shielding material.
Use a wrist strap connected to a properly grounded work surface and use properly grounded tools and
equipment.
Use conductive eld service tools, such as cutters, screw drivers, and vacuums.
When xtures must directly contact dissipative surfaces, use xtures made only of static-safe materials.
Keep the work area free of nonconductive materials, such as ordinary plastic assembly aids and
Styrofoam.
Handle ESD-sensitive components, parts, and assemblies by the case or PCM laminate. Handle these
items only at static-free workstations.
Avoid contact with pins, leads, or circuitry.
Turn o power and input signals before inserting or removing connectors or test equipment.
20 Chapter 4 Removal and replacement preliminary requirements

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HP X2 210 G2 Specifications

General IconGeneral
Form factorConvertible (Detachable)
Product typeHybrid (2-in-1)
Product colorSilver
Country of originChina
SteppingC0
Tjunction90 °C
Processor cache2 MB
Processor cores4
Processor familyIntel Atom®
Processor seriesIntel Atom x5 Series
Processor socketBGA 592
Processor codenameCherry Trail
Processor frequency1.44 GHz
Processor cache typeSmart Cache
Processor lithography14 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version2.0
Processor boost frequency1.84 GHz
Processor operating modes64-bit
PCI Express configurations1x1
Scenario Design Power (SDP)2 W
Maximum number of PCI Express lanes1
Numeric keypadNo
Pointing deviceTouchpad
Full-size keyboardYes
Internal memory2 GB
Internal memory typeDDR3L-SDRAM
Memory layout (slots x size)1 x 2 GB
Storage mediaeMMC
Total storage capacity32 GB
Compatible memory cardsMicroSD (TransFlash)
Display diagonal10.1 \
Touch technologyMulti-touch
Display resolution1280 x 800 pixels
Native aspect ratio16:10
Number of execution units12
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics
On-board graphics card base frequency200 MHz
On-board graphics card dynamic frequency (max)500 MHz
Battery capacity32.5 Wh
Number of battery cells2
AC adapter power45 W
Audio decodersDTS Studio Sound
Rear camera resolution (numeric)5 MP
Wi-Fi standards802.11a, Wi-Fi 5 (802.11ac), 802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version4.0
Charging port typeDC-in jack
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity0
Sustainability certificatesEPEAT Silver, ENERGY STAR
Processor codeSR29Z
Processor ARK ID87383
Processor package size17 x 17 mm
Intel Identity Protection Technology version1.00
Weight and Dimensions IconWeight and Dimensions
Depth170 mm
Width265 mm
Height16.2 mm
Weight1090 g
Height (tablet mode)9.2 mm
Weight (tablet mode)580 g

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